Patents by Inventor Joon Shyan TAN

Joon Shyan TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
    Publication number: 20230298956
    Abstract: A semiconductor package is disclosed. In one example, the semiconductor package includes a package body. A first diepad is at least partially uncovered by the package body at the first main surface. A second diepad is at least partially uncovered by the package body at the first main surface. A first semiconductor chip is arranged on the first diepad. A second semiconductor chip is arranged on the second diepad. The semiconductor package further includes at least one lead protruding out of the package body at the side surface. A first groove is formed in the first main surface, wherein the first groove is arranged between the first diepad and the second diepad, and a second groove is formed in the first main surface, wherein the second groove is arranged between the at least one lead and at least one of the first diepad and the second diepad.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 21, 2023
    Applicant: Infineon Technologies AG
    Inventors: Chii Shang HONG, Li Fong CHONG, Yee Beng DARYL YEOW, Edward FÜRGUT, Mei Fen HIEW, Azlina KASSIM, Ralf OTREMBA, Bernd SCHMOELZER, Joon Shyan TAN, Lee Shuang WANG