Abstract: Disclosed is a blood-compatible polymer represented by Formula 1. A polymer obtained by grafting a fluorinated methacrylate onto a polyvinylidene fluoride copolymer and provided in one aspect of the present invention is a polymer with blood compatibility, and may provide a blood-compatible material with hydrophobicity. In addition, it is possible to provide a material with controlled contact angle and surface energy properties by controlling the hydrogen fluoride length of the fluorinated methacrylate monomer for modification. Furthermore, it is possible to provide coating with controlled surface properties and blood compatibility through a simple process. Furthermore, it is possible to provide a freestanding polymer film with blood compatibility.

Abstract: A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or e

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or e

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; a first via portion disposed in the first insulating layer; and a second via portion disposed in the second insulating layer; wherein the first via portion includes: a first via part passing through the first insulating layer; a first-first pad disposed on an upper surface of the first insulating layer and connected to an upper surface of the first via part; and a first-second pad disposed on a lower surface of the first insulating layer and connected to a lower surface of the first via part; wherein the second via portion includes: a second via part passing through the second insulating layer and having a lower surface connected to an upper surface of the first-first pad; a second pad disposed on an upper surface of the second insulating layer and connected to an upper surface of the second via part; wherein a width of the first-first pad is smaller than or e

Abstract: A printed circuit board according to an embodiment includes an insulating layer; and a via portion disposed on the insulating layer; wherein the via portion includes: a first pad disposed under the insulating layer; a second pad disposed on the insulating layer; and a via part disposed between the first and second pads in the insulating layer; and wherein a width of the first pad is less than or equal to a width of a lower surface of the via part.

Abstract: Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.

Abstract: Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.

Abstract: Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.

Abstract: A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.

Abstract: An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract: Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.

Abstract: An optical printed circuit board is provided. The optical printed circuit board includes an insulation member, an optical fiber disposed in the insulation member and having opposite end portions exposed to a side of the insulation member, and at least one supporting member provided with a guide portion coupled to the opposite end portions of the optical fiber and guiding bending of the optical fiber.

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract: A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.

Abstract: A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of the first metal films to form a base member. A first connection portion may then be formed on each of the first metal films, and a second connection portion may be integrally formed on each of the first connection portions. A second metal film may then be formed on each of the second connection portions so as to be electrically connected to the connection portions, and, in turn, to the first metal films. Specific portions of the second metal films may be etched to form copper patterns. Upper and lower portions may then be separated by the releasing films to form separate multi-layer printed circuit boards.

Abstract: A fabricating method for a multi-layer printed circuit board comprises the steps of: attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to the releasing film, thereby forming a base member; forming a first connection portion on the first metal film by an electroplating process; forming a connection portion that a second connection portion is integrally formed with the first connection portion on the first connection portion; forming a second metal film on the second connection portion so as to be electrically connected to the connection portion; and etching a specific part of the second metal film and thereby forming copper patterns.

Abstract: A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.