Abstract: Disclosed herein are an organic light emitting diode including: at least two light emitting stacks interposed between an anode and a cathode and including at least one light emitting material layer; and a charge generation layer interposed between the light emitting stacks. The charge generation layer includes an N-type charge generation layer and a P-type charge generation layer, wherein the N-type charge generation layer and the P-type charge generation layer are stacked in such direction for the N-type charge generation layer to face the anode and for the P-type charge generation layer to face the cathode. The N-type charge generation layer includes a compound represented by Formula 1. The P-type charge generation layer includes any one selected from the group consisting of a compound represented by Formula 2, a compound represented by Formula 3, and a combination thereof.

Abstract: Disclosed herein are an organic light emitting diode including: at least two light emitting stacks interposed between an anode and a cathode and including at least one light emitting material layer; and a charge generation layer interposed between the light emitting stacks. The charge generation layer includes an N-type charge generation layer and a P-type charge generation layer, wherein the N-type charge generation layer and the P-type charge generation layer are stacked in such direction for the N-type charge generation layer to face the anode and for the P-type charge generation layer to face the cathode. The N-type charge generation layer includes a compound represented by Formula 1. The P-type charge generation layer includes any one selected from the group consisting of a compound represented by Formula 2, a compound represented by Formula 3, and a combination thereof.

Abstract: An automatic teller machine (ATM) has a cassette apparatus, detachably accommodated in a cassette accommodating space of the ATM, for storing the cheques endorsed by a printing unit therein. The cassette apparatus includes a storage cassette for stacking the cheques in a cheque storage position thereof, a transfer unit for transferring the cheques provided thereto, a cassette driving unit for driving the transfer unit when the storage cassette is accommodated into the cassette accommodating space, and a stacking unit installed in the cassette accommodating space for taking out the cheques transferred to a designated position and stacking the cheques on the cheque storage position.

Abstract: The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together.

Abstract: The present invention relates to phosphor blend for wavelength conversion and a white light emitting device using the same. The phosphor blend of the invention comprises three phosphors, A5 (PO4)3Cl:Eu2+, D2SiO4:Eu, and MS:Eu at a composition where near ultraviolet radiation is converted into light positioned at a CIE coordinate (x, y),where 0.25?x?0.45 and 0.25?x?0.43, wherein A comprises at least one of Sr, Ca, Ba, and Mg, D comprises at least one of Ba, Sr, and Ca, and M comprises at least one of Sr and Ca. Furthermore, the present invention provides a new white light emitting device in combination of the phosphor blend and a near ultraviolet LED.

Abstract: The present invention provides a phosphor blend for wavelength conversion and a white light emitting device using the phosphor blend. Further disclosed is a white light emitting phosphor blend comprising 0.5˜18 wt % of A5(PO4)3Cl:Eu2+ (where A is at least one element selected from Sr, Ca, Ba and Mg), 0.7˜14 wt of D2SiO4:Eu (where D is at least one element selected from Ba, Sr and Ca), and 68˜98.5 wt % of G5EuS(WO4)2.5+1.5S:Sm (where G is at least one element selected from Li, Na and K; and s is a number between 1 and 5), based on the total weight of the phosphor blend.

Abstract: Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

Abstract: Disclosed herein is a method for producing a molding compound resin tablet for wavelength conversion. The method comprises the steps of wet-dispersing a phosphor powder in a translucent liquid resin to form a molding compound resin body in which the phosphor powder is dispersed, and grinding the molding compound resin body into a powder form and applying a predetermined pressure to the resin powder. Further disclosed is a method for manufacturing a white light emitting diode using the molding compound resin tablet by a transfer molding process.

Abstract: Disclosed are a chip scale package and a method of fabricating the chip scale package. The chip scale package comprises conductive layers with a designated depth formed on an upper and a lower surfaces of a chip, and electrode surfaces formed on the same side surfaces of the conductive layers, which are connected to corresponding connection pads of a printed circuit board. The chip scale package is miniaturized in the whole package size. Further, the method of fabricating the chip scale package does not require a wire-bonding step or a via hole forming step, thereby simplifying the fabrication process of the chip scale package and improving the reliability of the chip scale package.

Abstract: The present invention relates to a warp knit having excellent touch and a process of preparing such a warp knit. The present invention provides a warp knit consisting of a technical face, a rear face, and an intermediate spacer arranged between the technical face and the rear face, the technical face consisting of ultra fine yarn with monofilament denier of 0.01 to about 0.3 denier, the intermediate spacer consisting of spandex elastic yarn, and the rear face consisting of synthetic yarn with monofilament denier of 1 to about 5 denier, wherein the recovery rate of elongation in the directions of wale and course is 25 to about 60%. The warp knit according to the present invention can be used to manufacture artificial leathers or ladies' clothes.

Abstract: The present invention relates to a warp knit fabric having excellent touch and a process of preparing such a warp knit. The present invention provides a warp knit fabric having a technical face and a rear face, the technical face consisting of ultra fine yarn with monofilament denier of 0.01 to about 0.9 denier, the rear face consisting of synthetic yarn or high shrinkage yarn with monofilament denier of 1 to about 5 denier, wherein the recovery rate of elongation in the directions of wale and course is 8 to about 30%. The warp knit according to the present invention can be used to manufacture artificial leathers or ladies' clothes.

Abstract: An overhead projector is provided, including a main body portion 10 including a light source, a head portion 20 which projects an image of a material put on the main body portion 10 onto a screen S, and a support portion 30 which supports the head portion 20 so that the head portion 20 ascends or descends over the main body portion 10.

Abstract: Disclosed are a chip scale package and a method of fabricating the chip scale package. The chip scale package comprises an insulating layer formed on the upper surface of a chip provided with a plurality of terminals on its one surface, a plurality of conductive layers formed on the insulating layer and spaced from each other by a designated distance so as to be connected to each of a plurality of the terminals, and a plurality of electrode surfaces formed on each of the upper surfaces of a plurality of the conductive layers. The chip scale package is miniaturized in the whole package size. Further, the method of fabricating the chip scale package does not require a wire-bonding step or a via hole forming step, thereby simplifying the fabrication process of the chip scale package and improving the reliability of the chip scale package.