Abstract: In a system of manufacturing an orthodontic wire, a method for manufacturing the orthodontic wire using the system, and an orthodontic wire bending machine for performing the system, the system includes a teeth data obtaining part, a simulating part, a calculating part and a wire manufacturing part. The teeth data obtaining part obtains present teeth data of a patient. The simulating part generates final teeth data. The calculating part compares a predetermined threshold to a compared value between the present teeth data of the patient and the final teeth data. The wire manufacturing part selectively manufactures a wire for an orthodontic process or a wire for a dentition maintenance process based on a compared result of the calculating part.

Abstract: In a system of manufacturing an orthodontic wire, a method for manufacturing the orthodontic wire using the system, and an orthodontic wire bending machine for performing the system, the system includes a teeth data obtaining part, a simulating part, a calculating part and a wire manufacturing part. The teeth data obtaining part obtains present teeth data of a patient. The simulating part generates final teeth data. The calculating part compares a predetermined threshold to a compared value between the present teeth data of the patient and the final teeth data. The wire manufacturing part selectively manufactures a wire for an orthodontic process or a wire for a dentition maintenance process based on a compared result of the calculating part.

Abstract: In a system of manufacturing an orthodontic wire, a method for manufacturing the orthodontic wire using the system, and an orthodontic wire bending machine for performing the system, the system includes a teeth data obtaining part, a simulating part, a calculating part and a wire manufacturing part. The teeth data obtaining part obtains present teeth data of a patient. The simulating part generates final teeth data. The calculating part compares a predetermined threshold to a compared value between the present teeth data of the patient and the final teeth data. The wire manufacturing part selectively manufactures a wire for an orthodontic process or a wire for a dentition maintenance process based on a compared result of the calculating part.

Abstract: In a system of manufacturing an orthodontic wire, a method for manufacturing the orthodontic wire using the system, and an orthodontic wire bending machine for performing the system, the system includes a teeth data obtaining part, a simulating part, a calculating part and a wire manufacturing part. The teeth data obtaining part obtains present teeth data of a patient. The simulating part generates final teeth data. The calculating part compares a predetermined threshold to a compared value between the present teeth data of the patient and the final teeth data. The wire manufacturing part selectively manufactures a wire for an orthodontic process or a wire for a dentition maintenance process based on a compared result of the calculating part.

Abstract: In a flexible substrate and a method for manufacturing the flexible substrate, the flexible substrate includes a polymer substrate, a through conductive material, an upper conductive material and a lower conductive material. The polymer substrate has a via-hole, and the via-hole is formed by a pattern formed via a photolithography and passes through the polymer substrate. The through conductive material fills the via-hole of the polymer substrate. The upper conductive material is planarized and is patterned to form an upper substrate of the polymer substrate in a plane with an upper substrate of the through conductive material. The lower conductive material is planarized and is patterned to form a lower substrate of the polymer substrate in a plane with a lower substrate of the through conductive material.

Abstract: The present invention relates to an apparatus and method for attenuation of vibration in a machine tool, and more particularly, to an apparatus and method for attenuation of vibration in a machine tool in which a vibration of a machine tool is measured, and generates an identical frequency with a piezoelectric actuator as well as changes a phase for making dissipative interference of a generated vibration wave form.

Abstract: In a flexible substrate and a method for manufacturing the flexible substrate, the flexible substrate includes a polymer substrate, a through conductive material, an upper conductive material and a lower conductive material. The polymer substrate has a via-hole, and the via-hole is formed by a pattern formed via a photolithography and passes through the polymer substrate. The through conductive material fills the via-hole of the polymer substrate. The upper conductive material is planarized and is patterned to form an upper substrate of the polymer substrate in a plane with an upper substrate of the through conductive material. The lower conductive material is planarized and is patterned to form a lower substrate of the polymer substrate in a plane with a lower substrate of the through conductive material.

Abstract: The present invention relates to an apparatus and method for attenuation of vibration in a machine tool, and more particularly, to an apparatus and method for attenuation of vibration in a machine tool in which a vibration of a machine tool is measured, and generates an identical frequency with a piezoelectric actuator as well as changes a phase for making dissipative interference of a generated vibration wave form.

Abstract: The present invention relates to a semiconductor chip stack package and a manufacturing method thereof, and more particularly, to a semiconductor chip stack package and a manufacturing method thereof in which a plurality of chips can be rapidly arranged and bonded without a precise device or operation so as to improve productivity.

Abstract: The present invention relates to a semiconductor chip stack package and a manufacturing method thereof, and more particularly, to a semiconductor chip stack package and a manufacturing method thereof in which a plurality of chips can be rapidly arranged and bonded without a precise device or operation so as to improve productivity

Abstract: The present invention relates to a through silicon via (TSV) for 3D packaging to integrate a semiconductor device and a method for manufacturing the same, and more particularly, to a through silicon via (TSV) for 3D packaging of a semiconductor device that is capable of improving production efficiency, having very high electric conductivity, and minimizing electrical signal delay, without using a carrier wafer by self-aligning substrates in a low temperature state and sequentially bonding a plurality of semiconductor dies (or semiconductor chips), and a method of manufacturing the same.

Abstract: The present invention relates to a through silicon via (TSV) for 3D packaging to integrate a semiconductor device and a method for manufacturing the same, and more particularly, to a through silicon via (TSV) for 3D packaging of a semiconductor device that is capable of improving production efficiency, having very high electric conductivity, and minimizing electrical signal delay, without using a carrier wafer by self-aligning substrates in a low temperature state and sequentially bonding a plurality of semiconductor dies (or semiconductor chips), and a method of manufacturing the same.