Patents by Inventor Joonah Yoon
Joonah Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11152144Abstract: Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.Type: GrantFiled: April 13, 2017Date of Patent: October 19, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, William J. Gallagher, Yu Luo, Lubomyr T. Romankiw, Joonah Yoon
-
Patent number: 10784045Abstract: A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.Type: GrantFiled: September 15, 2015Date of Patent: September 22, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, William J. Gallagher, Sathana Kitayaporn, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Joonah Yoon
-
Patent number: 10763038Abstract: A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.Type: GrantFiled: November 24, 2015Date of Patent: September 1, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, William J. Gallagher, Sathana Kitayaporn, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Joonah Yoon
-
Patent number: 10043607Abstract: Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.Type: GrantFiled: May 2, 2016Date of Patent: August 7, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, William J. Gallagher, Yu Luo, Lubomyr T. Romankiw, Joonah Yoon
-
Publication number: 20170314136Abstract: Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.Type: ApplicationFiled: April 13, 2017Publication date: November 2, 2017Inventors: HARIKLIA DELIGIANNI, WILLIAM J. GALLAGHER, YU LUO, LUBOMYR T. ROMANKIW, JOONAH YOON
-
Publication number: 20170316855Abstract: Present disclosure relates to magnetic materials, chips having magnetic materials, and methods of forming magnetic materials. In certain embodiments, magnetic materials may include a seed layer, and a cobalt-based alloy formed on seed layer. The seed layer may include copper, cobalt, nickel, platinum, palladium, ruthenium, iron, nickel alloy, cobalt-iron-boron alloy, nickel-iron alloy, and any combination of these materials. In certain embodiments, the chip may include one or more on-chip magnetic structures. Each on-chip magnetic structure may include a seed layer, and a cobalt-based alloy formed on seed layer. In certain embodiments, method may include: placing a seed layer in an aqueous electroless plating bath to form a cobalt-based alloy on seed layer. In certain embodiments, the aqueous electroless plating bath may include sodium tetraborate, an alkali metal tartrate, ammonium sulfate, cobalt sulfate, ferric ammonium sulfate and sodium borohydride and has a pH between about 9 to about 13.Type: ApplicationFiled: May 2, 2016Publication date: November 2, 2017Inventors: HARIKLIA DELIGIANNI, WILLIAM J. GALLAGHER, YU LUO, LUBOMYR T. ROMANKIW, JOONAH YOON
-
Publication number: 20170076860Abstract: A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.Type: ApplicationFiled: November 24, 2015Publication date: March 16, 2017Inventors: Hariklia Deligianni, William J. Gallagher, Sathana Kitayaporn, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Joonah Yoon
-
Publication number: 20170076852Abstract: A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.Type: ApplicationFiled: September 15, 2015Publication date: March 16, 2017Inventors: Hariklia Deligianni, William J. Gallagher, Sathana Kitayaporn, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Joonah Yoon
-
Patent number: 9437718Abstract: A method of forming a semiconductor structure includes forming a first seed layer, a second seed layer and an intrinsic base spaced apart from each other and with the intrinsic base located between the first seed layer and the second seed layer on an insulator layer. The method further includes forming an emitter on the first seed layer and on a first vertical surface of the intrinsic base by epitaxially growing the emitter from the first seed layer and the first vertical surface of the intrinsic base, and forming a collector on the second seed layer and on a second vertical surface of the intrinsic base by epitaxially growing the collector from the second seed layer and the second vertical surface of the intrinsic base.Type: GrantFiled: May 12, 2015Date of Patent: September 6, 2016Assignee: International Business Machines CorporationInventors: Jin Cai, Kevin K. Chan, Tak H. Ning, Jeng-Bang Yau, Joonah Yoon
-
Patent number: 9318585Abstract: A method of forming a semiconductor structure includes forming a first seed layer, a second seed layer and an intrinsic base spaced apart from each other and with the intrinsic base located between the first seed layer and the second seed layer on an insulator layer. The method further includes forming an emitter on the first seed layer and on a first vertical surface of the intrinsic base by epitaxially growing the emitter from the first seed layer and the first vertical surface of the intrinsic base, and forming a collector on the second seed layer and on a second vertical surface of the intrinsic base by epitaxially growing the collector from the second seed layer and the second vertical surface of the intrinsic base.Type: GrantFiled: June 24, 2015Date of Patent: April 19, 2016Assignee: International Business Machines CorporationInventors: Jin Cai, Kevin K. Chan, Tak H. Ning, Jeng-Bang Yau, Joonah Yoon
-
Publication number: 20160087068Abstract: A method of forming a base extension region for a lateral bipolar transistor. The base extension region may include forming an extrinsic base on an intrinsic base layer, the intrinsic base layer is on an insulator layer, a top portion of the intrinsic base layer is exposed on opposite sides of the extrinsic base; forming a base extension region by recessing the exposed top portion of the intrinsic base layer to a recessed surface, the recessed surface is above a top surface of the insulator layer, the base extension region is a region of the intrinsic base layer remaining above the recessed surface; and forming an emitter/collector in the intrinsic base layer, an intrinsic base is a portion of the intrinsic base layer between the emitter/collector, the emitter/collector is a distance from the extrinsic base of no less than a thickness of the base extension region.Type: ApplicationFiled: September 24, 2014Publication date: March 24, 2016Inventors: Jin Cai, Kevin K. Chan, Christopher P. D'Emic, Tak H. Ning, Jeng-Bang Yau, Joonah Yoon