Abstract: Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device can also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.

Abstract: A laminated stack, such as a trackpad, is assembled by coupling components using an adhesive system. Assembly of the laminated stack includes forming an adhesive-spacing component on a first substrate, forming an adhesive-alignment-holding component on the first substrate in a perimeter around the adhesive-spacing component, forming a bonding component by filling an area within the perimeter with liquid adhesive, and bonding the first substrate to a second substrate by curing the bonding component. The first substrate and the second substrate may each be one of a touch-sensing component and a cover component. The adhesive-spacing component maintains a space between the first substrate and the second substrate while the bonding component cures. The adhesive-alignment-holding component maintains alignment of the first substrate and the second substrate while the bonding component cures.

Abstract: A laminated stack, such as a trackpad, is assembled by coupling components using an adhesive system. Assembly of the laminated stack includes forming an adhesive-spacing component on a first substrate, forming an adhesive-alignment-holding component on the first substrate in a perimeter around the adhesive-spacing component, forming a bonding component by filling an area within the perimeter with liquid adhesive, and bonding the first substrate to a second substrate by curing the bonding component. The first substrate and the second substrate may each be one of a touch-sensing component and a cover component. The adhesive-spacing component maintains a space between the first substrate and the second substrate while the bonding component cures. The adhesive-alignment-holding component maintains alignment of the first substrate and the second substrate while the bonding component cures.