Abstract: A capacitor assembly including at least one capacitor each having a first end and a second end spaced apart in a longitudinal direction, and a first terminal and a second terminal located at the first end of the capacitor, the first end being provided with a first surface, and the second end being provided with a second surface; a heat sink having a first cooling surface; and a connection system connecting the at least one capacitor heat conductively to the heat sink such that the second surface of each of the at least one capacitor is in heat conductive connection with the first cooling surface. The connection system is to in contact with the first surface of each of the at least one capacitor.

Abstract: An electrical contact arrangement electrically contacts at least two power semiconductor devices, and comprises at least two bond wires and at least three electrical contacts, comprising an alternating current contact, a positive direct current contact, and a negative direct current contact. Each electrical contact comprises a ground potential part; contact part; and insulation part on the ground potential part. The contact part is provided on the insulation part. At least two electrical contacts are separated by a gap between the insulation parts and the gap between the contact parts of the separated electrical contacts. A bond wire connects a first power semiconductor device on a contact part of the positive direct current contact with a contact part of the alternating current contact. A bond wire connects a second power semiconductor device on the contact part of the alternating current contact with a contact part of the negative direct current contact.

Abstract: A subrack including a frame defining a subrack space and adapted to receive a device module to an operative position, the frame comprising four side walls and an end wall. The subrack comprises a coupling system adapted for coupling the subrack to four other subracks in order to form a subrack matrix, the coupling system comprising at least one wall recess on an inner surface of each of the side walls, and at least one primary screw hole in each of the side walls such that the at least one primary screw hole is located in the at least one wall recess.

Abstract: A capacitor assembly including at least one capacitor each having a first end and a second end spaced apart in a longitudinal direction, and a first terminal and a second terminal located at the first end of the capacitor, the first end being provided with a first surface, and the second end being provided with a second surface; a heat sink having a first cooling surface; and a connection system connecting the at least one capacitor heat conductively to the heat sink such that the second surface of each of the at least one capacitor is in heat conductive connection with the first cooling surface. The connection system is to in contact with the first surface of each of the at least one capacitor.

Abstract: A subrack including a frame defining a subrack space and adapted to receive a device module to an operative position, the frame comprising four side walls and an end wall. The subrack comprises a coupling system adapted for coupling the subrack to four other subracks in order to form a subrack matrix, the coupling system comprising at least one wall recess on an inner surface of each of the side walls, and at least one primary screw hole in each of the side walls such that the at least one primary screw hole is located in the at least one wall recess.

Abstract: Unique systems, methods, techniques and apparatuses of an exciterless synchronous machine are disclosed. One exemplary embodiment is a salient pole rotor for an electric machine including one set of pole pairs including a first, second, and third pole pair; a field winding; a set of energy harvest windings, each winding mounted to each of the plurality of pole pairs and structured to receive a harmonic component of AC power from a stator; and a DC power supply structured to receive the harmonic component from the set of energy harvest windings, convert the harmonic component to DC power, and output the DC power to the field winding. The set of energy harvest windings are arranged in a first sequence on the first pole pair, a second sequence on the second pole pair, and a third sequence on the third pole pair, and each sequence is different.

Abstract: Unique systems, methods, techniques and apparatuses of semiconductor failure prognostication. One exemplary embodiment is a power converter comprising a semiconductor switch and a converter control system. The converter control system is configured to turn on the semiconductor switch, measure a first voltage and a current during reverse conduction, estimate junction temperature of the semiconductor device, turn off the semiconductor device, measure a second voltage after turning off the semiconductor device, determine a resistance value using the second voltage measurement, determine an expected resistance value, predict a failure of the semiconductor device using the resistance value and the expected resistance value, and transmit a semiconductor device failure warning.

Abstract: Unique systems, methods, techniques and apparatuses of an exciterless synchronous machine are disclosed. One exemplary embodiment is a salient pole rotor for an electric machine comprising one set of pole pairs including a first, second, and third pole pair; a field winding; a set of energy harvest windings, each winding mounted to each of the plurality of pole pairs and structured to receive a harmonic component of AC power from a stator; and a DC power supply structured to receive the harmonic component from the set of energy harvest windings, convert the harmonic component to DC power, and output the DC power to the field winding. The set of energy harvest windings are arranged in a first sequence on the first pole pair, a second sequence on the second pole pair, and a third sequence on the third pole pair, and each sequence is different.

Abstract: Unique systems, methods, techniques and apparatuses of semiconductor failure prognostication. One exemplary embodiment is a power converter comprising a semiconductor switch and a converter control system. The converter control system is configured to turn on the semiconductor switch, measure a first voltage and a current during reverse conduction, estimate junction temperature of the semiconductor device, turn off the semiconductor device, measure a second voltage after turning off the semiconductor device, determine a resistance value using the second voltage measurement, determine an expected resistance value, predict a failure of the semiconductor device using the resistance value and the expected resistance value, and transmit a semiconductor device failure warning.

Abstract: Exemplary embodiments are directed to a system, method, apparatus, and arrangement for operating a photovoltaic system. The photovoltaic system including a boost converter having a controllable duty ratio, at least two strings of photovoltaic panels supplying an input of the boost converter, wherein the strings are connected in parallel with each other. The system having detector configured to detect a reverse current in any of the strings, and a controller configured to increase, in response to the detection of a reverse current in at least one of the strings, the duty ratio of the boost converter at least until the reverse current stops.