Patents by Inventor Joong-do Kom

Joong-do Kom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6150711
    Abstract: A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: November 21, 2000
    Assignee: Samsung Aerospace Industries, Ltd
    Inventors: Joong-do Kom, Young-ho Baek, Kyung-soon Bok