Patents by Inventor Joong-Geun Shin

Joong-Geun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7766212
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 3, 2010
    Assignee: W.C. Heraeus GmbH
    Inventors: Dong-Ik Yang, Eun-Kyun Chung, Joong-Geun Shin, Nam-Kwon Cho
  • Publication number: 20090072063
    Abstract: A spool includes a body and a chromium layer. The body integrally includes a first portion having an annular shape and a second portion having a tubular shape. The body is formed using plastic. The first portion is provided on both sides of the second portion. The chromium layer is plated on the body. The chromium layer has a uniform thickness of about 0.1 ?m to about 100 ?m. A gold alloy wire is wound on the chromium layer. The chromium layer has a glossy surface. The spool is combined with a bonding device such that the spool electrically connects the bonding device to the gold alloy wire wound on the chromium layer. The shape of the spool is not easily changed by an external impact. When the gold alloy wire is wound on the spool, a scratch is not formed on the spool. Furthermore, the cost required for forming the spool is relatively small so that the spool may be used as an expendable supply. As a result, a recycling process is not required.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 19, 2009
    Applicant: W.C. HERAEUS GMBH
    Inventors: Dong-Ik YANG, Eun-Kyun CHUNG, Joong-Geun SHIN, Nam-Kwon CHO