Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: To provide a thermosetting resin composition that provides a cured product excellent in low-dielectric properties, high heat resistance, high adhesiveness, and the like. The thermosetting resin composition includes an aromatic polyhydroxy compound represented by the following formula (1), and a maleimide compound. In the formula, R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and n represents the number of repetitions and an average value thereof is a number of 1 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R1 represents a hydrocarbon group having 1 to 8 carbon atoms, R2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: A composition for an antifogging coating includes isosorbide epoxy represented by Formula 1 below, a hardener, a hardening accelerator, and a silane coupling agent, wherein n is 0.2 to 7.

Abstract: A composition for an antifogging coating includes isosorbide epoxy represented by Formula 1 below, a hardener, a hardening accelerator, and a silane coupling agent, wherein n is 0.2 to 7.