Abstract: Disclosed herein are an apparatus and method for processing vehicle data security based on a cloud.

Abstract: A method of fabricating a semiconductor device includes forming a buffer insulating film over a semiconductor substrate including a conductive pattern. The buffer insulating film is etched using a storage node mask to form a buffer insulating pattern exposing the conductive pattern. The buffer insulating pattern defines a region wider than a storage node region. An etch stop film is formed over the conductive pattern and the buffer insulating pattern. An interlayer insulating film is formed over the etch stop film. The interlayer insulating film is etched using the storage node mask to expose the etch stop film. The exposed etch stop film is etched to form the storage node region exposing conductive pattern. A lower storage node is formed over the storage node region.

Abstract: A method of fabricating a semiconductor device includes forming a buffer insulating film over a semiconductor substrate including a conductive pattern. The buffer insulating film is etched using a storage node mask to form a buffer insulating pattern exposing the conductive pattern. The buffer insulating pattern defines a region wider than a storage node region. An etch stop film is formed over the conductive pattern and the buffer insulating pattern. An interlayer insulating film is formed over the etch stop film. The interlayer insulating film is etched using the storage node mask to expose the etch stop film. The exposed etch stop film is etched to form the storage node region exposing conductive pattern. A lower storage node is formed over the storage node region.

Abstract: A method of fabricating a semiconductor device includes forming a buffer insulating film over a semiconductor substrate including a conductive pattern. The buffer insulating film is etched using a storage node mask to form a buffer insulating pattern exposing the conductive pattern. The buffer insulating pattern defines a region wider than a storage node region. An etch stop film is formed over the conductive pattern and the buffer insulating pattern. An interlayer insulating film is formed over the etch stop film. The interlayer insulating film is etched using the storage node mask to expose the etch stop film. The exposed etch stop film is etched to form the storage node region exposing conductive pattern. A lower storage node is formed over the storage node region.

Abstract: An organic anti-reflective material, in particular one which prevents back reflection from the surface of or lower layers in the semiconductor device and eliminates the standing waves and reflective notching due to the optical properties of lower layers on the wafer, and due to the changes in the thickness of the photosensitive film applied thereon. The organic anti-reflective polymer is useful for forming ultrafine patterns of 64M, 256M, 1G, and 4G DRAM semiconductor devices. A composition containing such an organic anti-reflective polymer, and an anti-reflective coating formed therefrom and a preparation method thereof are also disclosed.

Abstract: An organic anti-reflective material, in particular one which prevents back reflection from the surface of or lower layers in the semiconductor device and eliminates the standing waves and reflective notching due to the optical properties of lower layers on the wafer, and due to the changes in the thickness of the photosensitive film applied thereon. The organic anti-reflective polymer is useful for forming ultrafine patterns of 64M, 256M, 1G, and 4G DRAM semiconductor devices. A composition containing such an organic anti-reflective polymer, and an anti-reflective coating formed therefrom and a preparation method thereof are also disclosed.