Abstract: In order to inspect a three dimensional shape, a predetermined inspection target component formed on a board is selected as the measurement target, a shape of the inspection target component is acquired, a reference point of the inspection target component is detected, relative location information of a polarity mark formed on the inspection target component with respect to the reference point is acquired, and it is judged whether the inspection target component is good or bad by checking whether the polarity mark exists or not by using the relative location information with respect to the reference point. Thus, the location of the polarity mark may be accurately known, and polarity inspection may be more easily and accurately performed.

Abstract: An inspection method for inspecting a device mounted on a substrate, includes generating a shape template of the device, acquiring height information of each pixel by projecting grating pattern light onto the substrate through a projecting section, generating a contrast map corresponding to the height information of each pixel, and comparing the contrast map with the shape template. Thus, a measurement object may be exactly extracted.

Abstract: An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

Abstract: A shape measurement apparatus includes a work stage supporting a target substrate, a pattern-projecting section including a light source, a grating part partially transmitting and blocking light generated by the light source to generate a grating image and a projecting lens part making the grating image on a measurement target of the target substrate, an image-capturing section capturing the grating image reflected by the measurement target of the target substrate, and a control section controlling the work stage, the pattern-projecting section and the image-capturing section, calculating a reliability index of the grating image and phases of the grating image, which is corresponding to the measurement target, and inspecting the measurement target by using the reliability index and the phases. Thus, the accuracy of measurement may be enhanced.

Abstract: In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured.

Abstract: The present invention can perform the optical measurement in the partially-specular object by preventing a generation of light saturation and blooming for an object with partially-specular characteristics by lowering the transmittance of specular lobe through the spatial light modulator. Therefore, the present invention can widen the measurement range up to the partially-specular object in the state where the advantages of the active optical measurement method of contactless, rapid measurement, and high precision are maintained.