Abstract: An integrated circuit may include a first active region and a second active region, and the first and second active regions may extend on a substrate in a first horizontal direction in parallel to each other and have different conductivity types from each other. A first gate line may extend in a second horizontal direction crossing the first horizontal direction, and may form a first transistor with the first active region. The first transistor may include a gate to which a first input signal is applied. The first gate line may include a first partial gate line that overlaps the first active region in a perpendicular direction and that has an end on a region between the first and second active regions.

Abstract: A gripper includes a body part, a finger base part coupled to the body part to be rotatable, the finger base part including a first finger base part and a second finger base part configured such that when the first finger base part is rotated in a first direction with respect to the body part, the second finger base part is provided to be rotatable in a second direction opposite the first direction with respect to the body part, and a finger part coupled to a first side of the body part or the finger base part to be reciprocal.

Abstract: A gripper includes a body part, a finger base part coupled to the body part, and a finger part coupled to a first side of the body part or the finger base part and coupled to the body part or the finger base part to be reciprocal, wherein the finger part comprises a first link structure and a second link structure, sides of which are coupled to the finger base part, respectively, and wherein, in the first link structure and the second link structure, a first support area of the first link structure and a second support area of the second link structure reciprocate in only one of a plurality of directions that cross a direction in which the finger part reciprocates with respect to the finger base part.

Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.

Abstract: A refrigerator includes a storage chamber having an opening; a drawer type door to open or close the opening; a display positioned at the drawer type door; a first connector provided at a sidewall of the storage chamber; a second connector provided at the drawer type door and being electrically connected to the display; a first frame coupled to an inner wall of the storage chamber, the first frame to cover the first connector; a second frame coupled to the drawer type door, the second frame to support a storage box; and a wire electrically connected between the first connector and the second connector. The first frame has a first accommodating part to accommodate one portion of the wire and the second frame has a second accommodating part to accommodate another portion of the wire.

Abstract: A method for manufacturing a hot-stamped part includes reheating a steel slab at a temperature of 1,200° C. to 1,250° C., the steel slab including, by wt %, 0.20 to 0.50% carbon (C), 0.05 to 1.00% silicon (Si), 0.10 to 2.50% manganese (Mn), more than 0% and not more than 0.015% phosphorus (P), more than 0% and not more than 0.005% sulfur (S), 0.05 to 1.00% chromium (Cr), 0.001 to 0.009% boron (B), 0.01 to 0.09% titanium (Ti), and a balance of iron (Fe) and inevitable impurities; finish-rolling the reheated steel slab at a temperature of 880° C. to 950° C.; cooling the hot-rolled steel plate without using water, and coiling the cooled steel plate at a temperature of 680° C. to 800° C. to form a hot-rolled decarburized layer on a surface of the steel plate; pickling the coiled steel plate, followed by cold rolling; annealing the cold-rolled steel plate in a reducing atmosphere; plating the annealed steel plate; and hot-stamping the plated steel plate.

Abstract: A method for manufacturing a hot-stamped part includes reheating a steel slab at a temperature of 1,200° C. to 1,250° C., the steel slab including, by wt %, 0.20 to 0.50% carbon (C), 0.05 to 1.00% silicon (Si), 0.10 to 2.50% manganese (Mn), more than 0% and not more than 0.015% phosphorus (P), more than 0% and not more than 0.005% sulfur (S), 0.05 to 1.00% chromium (Cr), 0.001 to 0.009% boron (B), 0.01 to 0.09% titanium (Ti), and a balance of iron (Fe) and inevitable impurities; finish-rolling the reheated steel slab at a temperature of 880° C. to 950° C.; cooling the hot-rolled steel plate without using water, and coiling the cooled steel plate at a temperature of 680° C. to 800° C. to form a hot-rolled decarburized layer on a surface of the steel plate; pickling the coiled steel plate, followed by cold rolling; annealing the cold-rolled steel plate in a reducing atmosphere; plating the annealed steel plate; and hot-stamping the plated steel plate.

Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev

Abstract: Embodiments include a method for manufacturing a hot-rolled coil and a method for correcting the shape of a hot-rolled coil. In one embodiment, the method for manufacturing the hot-rolled coil includes the steps of: reheating a steel slab comprising 0.18 to 0.56 wt % carbon (C), 0.1 to 0.5 wt % silicon (Si), 0.7 to 6.5 wt % manganese (Mn), more than 0 wt % but not more than 0.02 wt % phosphorus (P), more than 0 wt % but not more than 0.02 wt % sulfur (S), more than 0 wt % but not more than 0.3 wt % chromium (Cr), more than 0 wt % but not more than 0.004 wt % boron (B), 0.01 to 0.04 wt % titanium (Ti), and the remainder being iron (Fe) and other inevitable impurities; hot-rolling the steel slab at a finishing mill delivery temperature of 850° C. to 950° C., thereby forming a hot-rolled sheet; and cooling the hot-rolled sheet, followed by coiling at a coiling temperature of 700° C. or higher.

Abstract: The present invention relates to a method for preparing N-[[1-{3-(1,2,3-triazol-1-yl)propyl}piperidin-4-yl]methyl]-4-amino-5-chloro-2-methoxybenzamide, which is a novel benzamide derivative as a 5-HT4 receptor agonist, or a pharmaceutically acceptable salt thereof; to a novel intermediate capable of being used in the preparation of the compounds; and to a method for preparing the same. The preparation methods of the present invention can be useful for mass production since a low-priced reagent and intermediate are used and the number of reaction processes is decreased, thereby saving preparation costs and improving the yield.

Abstract: The present invention relates to a method for preparing N-[[1-{3-(1,2,3-triazol-1-yl)propyl}piperidin-4-yl]methyl]-4-amino-5-chloro-2-methoxybenzamide, which is a novel benzamide derivative as a 5-HT4 receptor agonist, or a pharmaceutically acceptable salt thereof; to a novel intermediate capable of being used in the preparation of the compounds; and to a method for preparing the same. The preparation methods of the present invention can be useful for mass production since a low-priced reagent and intermediate are used and the number of reaction processes is decreased, thereby saving preparation costs and improving the yield.

Abstract: A method of cleaning a chamber used for annealing doped wafer substrates. In one embodiment the method provides removing dopants deposited in an annealing chamber after an annealing process of a doped substrate by flowing one or more volatilizing gases into the annealing chamber, applying heat to volatilize the deposited dopants in the annealing chamber, and exhausting the chamber to remove volatilized dopants from the annealing chamber.

Abstract: Provided is a method of providing learning contents by a server. The method includes providing a list of steps of review contents to a user terminal; receiving a selection of a step on the list of the steps of the review contents from the user terminal, and providing the review contents of the selected step to the user terminal; and providing a point score according to a learning performance on each step of the review contents by a user, and an evaluation score according to a correct answer rate, to the user terminal.

Abstract: A method of cleaning a chamber used for annealing doped wafer substrates. In one embodiment the method provides removing dopants deposited in an annealing chamber after an annealing process of a doped substrate by flowing one or more volatilizing gases into the annealing chamber, applying heat to volatilize the deposited dopants in the annealing chamber, and exhausting the chamber to remove volatilized dopants from the annealing chamber.

Abstract: Disclosed are an apparatus and method of determining an optimal cyclic delay value. The method of determining the optimal cyclic delay value includes determining a Signal-to-Interference and Noise Ratio (SINR) function depending on a diversity order; determining a channel estimation error variance function; and determining an SINR being required for a system according to the SINR function and the channel estimation error variance function.

Abstract: Disclosed are an apparatus and method of determining an optimal cyclic delay value. The method of determining the optimal cyclic delay value includes determining a Signal-to-Interference and Noise Ratio (SINR) function depending on a diversity order; determining a channel estimation error variance function; and determining an SINR being required for a system according to the SINR function and the channel estimation error variance function.

Abstract: The present invention provides a novel phenylpropionic acid derivative and a PPAR-? modulator comprising the same as an active ingredient. The phenylpropionic acid derivative of the present invention has modulatory action on function of PPAR-? and then exhibits hypoglycemic, hypolipidemic and insulin resistance-reducing effects on PPAR-mediated diseases or disorders. Therefore, the present invention is prophylactically or therapeutically effective for diabetes and metabolic diseases.

Abstract: A method of cleaning a chamber used for annealing doped wafer substrates. In one embodiment the method provides removing dopants deposited in an annealing chamber after an annealing process of a doped substrate by flowing one or more volatilizing gases into the annealing chamber, applying heat to volatilize the deposited dopants in the annealing chamber, and exhausting the chamber to remove volatilized dopants from the annealing chamber.