Patents by Inventor Joong Won PARK

Joong Won PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11127517
    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Joong Won Park, Young Seuck Yoo
  • Publication number: 20210280750
    Abstract: A method of repairing a display device, in which the display device includes a defective pixel area including a defective wavelength conversion patter, the method including removing the defective wavelength conversion pattern of the defective pixel area, injecting ink including a wavelength conversion material into the defective pixel area, and curing the ink injected into the defective pixel area.
    Type: Application
    Filed: September 21, 2020
    Publication date: September 9, 2021
    Inventors: Ill Won PARK, Ki Dae SHIN, Joong Keun LEE
  • Patent number: 11107614
    Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Jung Ho Cho, Jung Wook Seo, Young Seuck Yoo, Joong Won Park
  • Publication number: 20210217546
    Abstract: A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.
    Type: Application
    Filed: May 20, 2020
    Publication date: July 15, 2021
    Inventors: Il Jin PARK, Jun Sung LEE, Joong Won PARK, Gwang Hwan HWANG, Soon Kwang KWON
  • Patent number: 11056275
    Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Joong Won Park, Jung Wook Seo
  • Publication number: 20200143972
    Abstract: A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a D50 of 3.5 ?m or less.
    Type: Application
    Filed: September 6, 2019
    Publication date: May 7, 2020
    Inventors: Il Jin PARK, Joong Won PARK, Se Hyung LEE, Soon Kwang KWON
  • Publication number: 20190259519
    Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
    Type: Application
    Filed: August 30, 2018
    Publication date: August 22, 2019
    Inventors: Soon Kwang KWON, Jung Ho CHO, Jung Wook SEO, Young Seuck YOO, Joong Won PARK
  • Publication number: 20190198236
    Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.
    Type: Application
    Filed: June 11, 2018
    Publication date: June 27, 2019
    Inventors: Soon Kwang KWON, Young Seuck YOO, Joong Won PARK, Jung Wook SEO
  • Publication number: 20190198211
    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
    Type: Application
    Filed: August 9, 2018
    Publication date: June 27, 2019
    Inventors: Soon Kwang KWON, Joong Won PARK, Young Seuck YOO