Abstract: Provided is a method for manufacturing a semiconductor package. In the method, a wafer for a cap substrate is provided. The wafer for the cap substrate includes a plurality of vias and via electrodes on a lower surface. A wafer for a device substrate is provided. The wafer for the device substrate includes a circuit unit and a connection electrode on an upper surface. The wafer for the cap substrate and the wafer for the device substrate are primarily bonded by a medium of a primary adhesive. A trench is formed to expose the upper surface of the wafer for the device substrate to an outside along an outer edge of the primary adhesive. A secondary bonding operation is performed by a medium of a secondary adhesive to electrically connect the via electrode and the connection electrode. The wafer for the device substrate is diced along a virtual cut line.

Abstract: Provided are a method and a system for playing a game helping get a job and a method and a system for playing a game helping entering into a university or a school of higher grade. The present invention, through the game, provides an advantage of enabling a job applicant to get a basic understanding of a culture of a company which he/her actually wants to enter into and to get in advance familiar with a style of a written examination and an interview required by the company. More specifically, the job applicant may be in advance familiar with employment requirements provided by the company and he/she, through the game, may be motivated to study for the examination and the interview in an interesting way. Also, the company, through the game, may employ a competent person with a good grounding required of its employees.

Abstract: A method of operating a packaged flash memory module includes applying a first program or erase command and a first address associated with the first commend to a first flash memory chip of a plurality of flash memory chips that are arranged within the packaged flash memory module; applying a second program or erase command and a second address associated with the second commend to a second flash memory chip of the plurality of flash memory chips that are arranged within the packaged flash memory module, the second command being applied to the second flash memory chip prior to the completion of the first command by the first flash memory chip; and determining whether or not the first flash memory chip has completed the first command. If the first command is determined to have not been completed by the first memory chip, examining whether or not a second flash memory chip has completed the second command.

Abstract: A method for performing a program operation of a non-volatile memory device includes loading first, second, third, and fourth data to first, second, third, and fourth page buffers, respectively, in sequence; programming the first data loaded onto the first page buffer into a first page while loading the second data to the second buffer; and programming the second data loaded onto the second page buffer into a second page while programming the first data into the first page.

Abstract: Disclosed herein are a semiconductor memory device and package thereof, and a memory card using the same. The semiconductor memory device may include a memory cell array in which a plurality of memory cells that share a word line constitutes a page. The same row address signal is inputted to two or more memory chips including a row decoder for selecting the page, so that predetermined pages of the two or more memory chips are selected at the same time. If the semiconductor memory device is packaged or applied to the memory card, the size of the page can be significantly reduced. Also, since data is alternately loaded into the memory chips or data of the memory chips is alternately outputted, an overall program and read speed can be thus improved. Therefore, the performance of the semiconductor memory device can be improved.

Abstract: An organic electroluminescence (EL) device capable of digital driving, and a method for manufacturing the same are disclosed herein. The organic EL device comprises a substrate, an anode formed on the substrate, an organic EL layer formed on the anode and constructed as a multilayer structure including a hole injection layer and a hole transport layer, a cathode formed on the organic EL layer, and an interface deterioration preventing layer formed between the anode and the organic EL layer.

Abstract: Provided is an organic EL device having a lower power consumption and high performance and enabling to display separate pictures on bidirectional screens as well as to display the same picture on the bidirectional screens, and a driving apparatus thereof. The organic EL device includes: a first organic EL panel for a unidirectional display; and a second organic EL panel for a unidirectional display, each of the first and second organic EL panels having a substrate, a first electrode, an emitting layer and a second electrode, wherein the first organic EL panel and the second organic EL panel are coupled so as to display pictures in bidirections. According to the present invention, a sufficient brightness can be obtained even under a low power. Also, since an opaque cathode is used, performance and transmittance are enhanced compared with the related art organic EL device using a transparent cathode.