Abstract: A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

Abstract: A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

Abstract: A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

Abstract: A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.

Abstract: The present invention relates to a pharmaceutical composition for forming a film directly on a wound to accelerate wound healing, a use for the same, a treatment method using the same, and a method for preparing the same. The film-forming composition according to the present invention forms a film directly on the wound to increase the adhesion to the wound. The formed thin hydrophilic film protects the wound surface to prevent infection of the wound surface, retains the physiologically active substance useful for wound healing on the wound surface to promote the wound healing, and allow drugs to be continuously delivered to the wound surface. Therefore, the composition according to the present invention has excellent wound healing effect and has excellent usability as it is not absorbed into clothing, bandage, etc., thus effectively replacing conventional gel or ointment formations for delivering physiologically active substances.

Abstract: The present invention relates to a pharmaceutical composition for forming a film directly on a wound to accelerate wound healing, a use for the same, a treatment method using the same, and a method for preparing the same. The film-forming composition according to the present invention forms a film directly on the wound to increase the adhesion to the wound. The formed thin hydrophilic film protects the wound surface to prevent infection of the wound surface, retains the physiologically active substance useful for wound healing on the wound surface to promote the wound healing, and allow drugs to be continuously delivered to the wound surface. Therefore, the composition according to the present invention has excellent wound healing effect and has excellent usability as it is not absorbed into clothing, bandage, etc., thus effectively replacing conventional gel or ointment formations for delivering physiologically active substances.