Abstract: Disclosed is a method for fabricating ceramic chip packages in which an epoxy resin containing fine ceramic particles is applied on a ceramic substrate provided with chip packages respectively having a plurality of chips mounted thereon, thereby improving reliability and endurance of the package and miniaturizing the size of the package. The epoxy resin is applied on the ceramic substrate provided with a plurality of the chips mounted thereon except a designated region, thereby minimizing the deformation of the substrate. The epoxy resin layer is formed on the substrate by two steps including a first step for forming a first epoxy resin layer serving as a dam and a second step for forming a second epoxy resin layer, thereby reducing the amount of the used epoxy resin and improving reliability and endurance of the package against temperature and humidity.