Patents by Inventor Joonsang YANG

Joonsang YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold assembly for injection molding
    Patent number: 11426907
    Abstract: Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: August 30, 2022
    Assignee: LG Electronics Inc.
    Inventors: Joonsang Yang, Kyungdo Kim, Seokjae Jeong, Youngkyu Kim
  • MOLD ASSEMBLY FOR INJECTION MOLDING
    Publication number: 20190030770
    Abstract: Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.
    Type: Application
    Filed: January 19, 2017
    Publication date: January 31, 2019
    Applicant: L G Electronics Inc.
    Inventors: Joonsang YANG, Kyungdo KIM, Seokjae JEONG, Youngkyu KIM