Abstract: A lift pin module includes a lift pin which includes a head portion disposed at a first end of the lift pin, and a connecting portion disposed at a second end of the lift pin opposite to the first end, the head portion connected to a stage disposed inside a semiconductor process chamber, and the head portion extending in a first direction; an upper weight which includes a side surface with an opening extending in the first direction, the opening configured to receive the lift pin therein, and the upper weight surrounding the connecting portion of the lift pin; and a lower weight screwed to the upper weight, the lower weight disposed below the upper weight.

Abstract: A lift pin module includes a lift pin which includes a head portion disposed at a first end of the lift pin, and a connecting portion disposed at a second end of the lift pin opposite to the first end, the head portion connected to a stage disposed inside a semiconductor process chamber, and the head portion extending in a first direction; an upper weight which includes a side surface with an opening extending in the first direction, the opening configured to receive the lift pin therein, and the upper weight surrounding the connecting portion of the lift pin; and a lower weight screwed to the upper weight, the lower weight disposed below the upper weight.

Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.

Abstract: A method of controlling a surveillance system having a visible imaging camera for obtaining a visible image of an object and a display apparatus, includes providing a color visible image, from the visible imaging camera, to the display apparatus and generating a color background image by extracting a background area from the color visible image when a current ambient illuminance belongs to a daytime illuminance range, and replacing a background area of a black and white visible image, from the visible imaging camera, with the color background image and providing a mixed image as a result of the replacement to the display apparatus when the current illuminance belongs to the nighttime illuminance range.

Abstract: A method of removing distortion by lipids from an MR image includes obtaining an MR image including voxels, obtaining data of the voxels from the obtained MR image, estimating a lipid-related spectrum by using the obtained data, and removing the estimated lipid-related spectrum from the obtained data.

Abstract: A method obtains main magnetic field information and radio frequency (RF) pulse related information in a magnetic resonance imaging (MRI) system, in which a pulse having a first flip angle and a pulse having a second flip angle are transmitted to a target object at predetermined time intervals. The method includes: obtaining at least one first response signal with respect to the pulse, having the first flip angle, from the target object; obtaining at least one second response signal, with respect to the pulse having the second flip angle, from the target object; and combining the at least one first response signal and the at least one second response signal to obtain the main magnetic field information and the RF pulse related information.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a core substrate having a cavity formed therein and a dummy chip inserted in the cavity.

Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.

Abstract: A method obtains a magnetic resonance (MR) spectrum of a voxel in a magnetic resonance (MR) image obtained from a magnetic resonance imaging (MRI) apparatus. The method includes configuring a sampling pattern of k-space data; sampling predetermined data from the k-space data based on the configured sampling pattern; and obtaining the MR spectrum of the voxel by using the sampled data.

Abstract: A method obtains a magnetic resonance (MR) spectrum of a voxel in a magnetic resonance (MR) image obtained from a magnetic resonance imaging (MRI) apparatus. The method includes configuring a sampling pattern of k-space data; sampling predetermined data from the k-space data based on the configured sampling pattern; and obtaining the MR spectrum of the voxel by using the sampled data.

Abstract: A method obtains main magnetic field information and radio frequency (RF) pulse related information in a magnetic resonance imaging (MRI) system, in which a pulse having a first flip angle and a pulse having a second flip angle are transmitted to a target object at predetermined time intervals. The method includes: obtaining at least one first response signal with respect to the pulse, having the first flip angle, from the target object; obtaining at least one second response signal, with respect to the pulse having the second flip angle, from the target object; and combining the at least one first response signal and the at least one second response signal to obtain the main magnetic field information and the RF pulse related information.

Abstract: A method of controlling a surveillance system having a visible imaging camera for obtaining a visible image of an object and a display apparatus, includes providing a color visible image, from the visible imaging camera, to the display apparatus and generating a color background image by extracting a background area from the color visible image when a current ambient illuminance belongs to a daytime illuminance range, and replacing a background area of a black and white visible image, from the visible imaging camera, with the color background image and providing a mixed image as a result of the replacement to the display apparatus when the current illuminance belongs to the nighttime illuminance range.

Abstract: A method of removing distortion by lipids from an MR image includes obtaining an MR image including voxels, obtaining data of the voxels from the obtained MR image, estimating a lipid-related spectrum by using the obtained data, and removing the estimated lipid-related spectrum from the obtained data.

Abstract: A solar cell is provided with a hetero-junction front structure (e.g., P/N or P/I/N) and is further provided in a back portion of thereof with a passivation layer having a plurality of openings defined therethrough. A BSF-forming binder material and a back face electrode are provided contacting the back surface and are fired to thereby bind the back face electrode to the structure and to form a BSF region extending from the openings of the passivation layer.

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the metal core, and a circuit pattern, which is coupled to one surface of the insulation layer. Thus, the printed circuit board can improve thermal conductivity and deformation resistance against warpage.

Abstract: A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material.

Abstract: A core substrate and a method of manufacturing the core substrate are disclosed. In accordance with an embodiment of the present invention, the core substrate includes an adhesive resin layer having a mineral filler added therein, a metal sheet, which is patterned and embedded in the adhesive resin layer, and an insulation layer, which is stacked on both surfaces of the adhesive resin layer. Since a through-hole is formed to correspond to the number of via holes in accordance with a higher density of a printed circuit board, no conventional land is required to be formed, thereby reducing the defect of eccentricity.

Abstract: The present invention provides a nonvolatile memory device having high reliability with novel sidewall spacer structures. The gate stack structure for use in a nonvolatile memory device comprises a semiconductor substrate, a gate stack formed on the semiconductor substrate. The gate stack has a sidewall and a top surface. A multi-layer sidewall spacer structure is formed on the sidewall of the gate stack. The multi-layer sidewall spacer structure includes a first oxide layer, a first nitride layer, a second oxide layer, and a second nitride layer that are sequentially stacked. With the present invention, even if the second nitride layer is perforated or damaged during the formation of contact holes, sidewalls of the gate stack of nonvolatile memory cell can be protected with the first nitride layer from mobile ions. Also, etching damage to source/drain regions or field regions can be reduced.

Abstract: The present invention provides a nonvolatile memory device having high reliability with novel sidewall spacer structures. The gate stack structure for use in a nonvolatile memory device comprises a semiconductor substrate, a gate stack formed on the semiconductor substrate. The gate stack has a sidewall and a top surface. A multi-layer sidewall spacer structure is formed on the sidewall of the gate stack. The multi-layer sidewall spacer structure includes a first oxide layer, a first nitride layer, a second oxide layer, and a second nitride layer that are sequentially stacked. With the present invention, even if the second nitride layer is perforated or damaged during the formation of contact holes, sidewalls of the gate stack of nonvolatile memory cell can be protected with the first nitride layer from mobile ions. Also, etching damage to source/drain regions or field regions can be reduced.

Abstract: A method for managing memory cells in a nonvolatile memory, such as a flash memory, includes detecting and intermediately programming fast-erased memory cells. All of the memory cells in a sector can then be erased.