Abstract: Provided are a multifold micro emitting device, a display apparatus, a method of manufacturing the multifold micro emitting device, and method of manufacturing the display apparatus. The multifold micro light emitting device includes a plurality of sub light emitting devices, a first electrode configured to apply a voltage to each of the plurality of sub light emitting devices, a second electrode configured to apply a common voltage to the plurality of sub light emitting devices, and a separator configured to separate the plurality of sub light emitting devices from each other, and the plurality of sub light emitting devices are configured as a single chip.

Abstract: A refrigerator includes a cabinet having a storage space, a hinge bracket configured to be installed on an upper wall of the cabinet and having a hinge shaft, a door configured to be connected to the hinge shaft and to open and close the storage space while rotating, and a hinge cover configured to be installed on the upper wall of the cabinet and to cover the hinge bracket, in which the hinge cover includes a first mounting part and a second mounting part disposed to be spaced apart in a horizontal direction, a bracket cover detachably mounted on one mounting part of the first mounting part and the second mounting part disposed at a position corresponding to the hinge bracket and configured to cover the hinge bracket, and a shielding member detachably mounted on another mounting part of the first mounting part and the second mounting part.

Abstract: A semiconductor device may include a barrier layer on a channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, and a source and a drain spaced apart from each other on the channel layer. The barrier layer may have a greater energy band gap than the channel layer. The gate semiconductor layer may include a first surface contacting the barrier layer and a second surface contacting the gate electrode, and a sidewall connecting the first surface with the second surface. An area of the second surface of the gate semiconductor layer may be narrower than an area of the first surface. The sidewall of the gate semiconductor layer may include a plurality of surfaces having different slopes.

Abstract: Provided are a power device and a manufacturing method thereof. A power device includes a compound semiconductor layer epitaxially grown on a substrate, a gate formed on the compound semiconductor layer, a source and a drain provided on either side of the gate, a passivation layer provided to cover the source, drain, and gate, and a cooling space region provided to form a cooling path inside the substrate. The cooling space region may be formed to a predetermined depth from the surface of the substrate and include an enlargement region having a width increasing according to a depth from the surface of the substrate. The width of an inlet of the cooling space region is less than a maximum width of the enlargement region, and the passivation layer and the compound semiconductor layer are provided to open the cooling space region.

Abstract: A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.

Abstract: Provided are a micro semiconductor chip transferring structure and a display device employing a display transferring structure. A transferring structure includes a transfer substrate having a plurality of grooves, and a plurality of micro semiconductor chips transferred to the plurality of grooves, respectively, wherein a minimum space between adjacent two of the plurality of micro semiconductor chips transferred to the plurality of grooves is 100% to 200% inclusive of a width of each of the plurality of micro semiconductor chips.

Abstract: A refrigerator includes a cabinet having a storage space, a hinge bracket configured to be installed on an upper wall of the cabinet and having a hinge shaft, a door configured to be connected to the hinge shaft and to open and close the storage space while rotating, and a hinge cover configured to be installed on the upper wall of the cabinet and to cover the hinge bracket, in which the hinge cover includes a first mounting part and a second mounting part disposed to be spaced apart in a horizontal direction, a bracket cover detachably mounted on one mounting part of the first mounting part and the second mounting part disposed at a position corresponding to the hinge bracket and configured to cover the hinge bracket, and a shielding member detachably mounted on another mounting part of the first mounting part and the second mounting part.

Abstract: A refrigerator includes a cabinet having a storage space, a hinge bracket configured to be installed on an upper wall of the cabinet and having a hinge shaft, a door configured to be connected to the hinge shaft and to open and close the storage space while rotating, and a hinge cover configured to be installed on the upper wall of the cabinet and to cover the hinge bracket, in which the hinge cover includes a first mounting part and a second mounting part disposed to be spaced apart in a horizontal direction, a bracket cover detachably mounted on one mounting part of the first mounting part and the second mounting part disposed at a position corresponding to the hinge bracket and configured to cover the hinge bracket, and a shielding member detachably mounted on another mounting part of the first mounting part and the second mounting part.

Abstract: A refrigerator includes a cabinet having a storage space, a hinge bracket configured to be installed on an upper wall of the cabinet and having a hinge shaft, a door configured to be connected to the hinge shaft and to open and close the storage space while rotating, and a hinge cover configured to be installed on the upper wall of the cabinet and to cover the hinge bracket, in which the hinge cover includes a first mounting part and a second mounting part disposed to be spaced apart in a horizontal direction, a bracket cover detachably mounted on one mounting part of the first mounting part and the second mounting part disposed at a position corresponding to the hinge bracket and configured to cover the hinge bracket, and a shielding member detachably mounted on another mounting part of the first mounting part and the second mounting part.

Abstract: A refrigerator includes a cabinet having a storage space, a hinge bracket configured to be installed on an upper wall of the cabinet and having a hinge shaft, a door configured to be connected to the hinge shaft and to open and close the storage space while rotating, and a hinge cover configured to be installed on the upper wall of the cabinet and to cover the hinge bracket, in which the hinge cover includes a first mounting part and a second mounting part disposed to be spaced apart in a horizontal direction, a bracket cover detachably mounted on one mounting part of the first mounting part and the second mounting part disposed at a position corresponding to the hinge bracket and configured to cover the hinge bracket, and a shielding member detachably mounted on another mounting part of the first mounting part and the second mounting part.