Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.

Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.

Abstract: In one or more embodiments, one or more systems, methods, and/or systems may provide an output signal via a first port of multiple ports; may determine that the output signal is detected via a second port of the multiple ports; if the first port and the second port are not capable of being coupled, may provide a notification that indicates that the first port and the second port are not capable of being coupled; and if the first port and the second port are capable of being coupled: may configure a Serializer/Deserializer (SerDes) associated with the first port to communicate with a SerDes associated with the second port; and may configure a first processor of multiple processors to communicate with a second processor of the multiple processors via the SerDes associated with the first port.