Patents by Inventor Jordan He

Jordan He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact image sensor module and method of assembly for image sensor modules
    Patent number: 10485404
    Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: November 26, 2019
    Assignee: KARL STORZ Endovision, Inc.
    Inventors: Dashiell Birnkrant, Gerard Vadenais, Jordan He, Jason Curtis
  • COMPACT IMAGE SENSOR MODULE AND METHOD OF ASSEMBLY FOR IMAGE SENSOR MODULES
    Publication number: 20170251913
    Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.
    Type: Application
    Filed: March 1, 2016
    Publication date: September 7, 2017
    Applicant: KARL STORZ Endovision, Inc.
    Inventors: Dashiell Birnkrant, Gerard Vadenais, Jordan He, Jason Curtis