Abstract: A probe sanding fixture includes a base, a probe adapter including a probe guide defining one or more channels defined therein, and a sander tool including a sanding wheel and a gauge pin configured to process one or more probes positioned in the channels. The probe adapter is coupleable to the base such that the channels are extendable generally along a first axis. The sander tool is coupled to the base such that the sander tools is translatable along a second axis and rotatable about the first axis.

Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.