Abstract: A temperature-regulating mattress system provides dynamic adjustment of temperature and other parameters throughout a user's sleep cycle to maximize the quality of the user's sleep, Features of the system may include: (a) heating and cooling temperature regulation (with dynamic custom profiles that control humidity and are dual-zone); (b) smart controls (with remotes and apps that learn from users to optimize settings and work with smart home products such as Alexa and interactive lighting systems); (c) comfort (with a mattress that provide the necessary support for its users); and (d) sensors used for temperature and humidity estimation algorithms, control mechanism, and additional inferences from those sensors (pose, enrichment of biometric sensing data, etc.).

Abstract: An interactive lighting system includes a group of one or more portable lamps designed to respond to user's spatial manipulation of a lamp to control the system. The lamps can be wirelessly linked to operate in unison, and each lamp could also include an ambient light sensor, which helps the system to optimize illumination characteristics and profile.

Abstract: An interactive lighting system includes a group of one or more portable lamps designed to respond to user's spatial manipulation of a lamp to control the system. The lamps can be wirelessly linked to operate in unison, and each lamp could also include an ambient light sensor, which helps the system to optimize illumination characteristics and profile.

Abstract: An integrated circuit structure includes a semiconductor substrate; a diode; and a phase change element over and electrically connected to the diode. The diode includes a first doped semiconductor region of a first conductivity type, wherein the first doped semiconductor region is embedded in the semiconductor substrate; and a second doped semiconductor region over and adjoining the first doped semiconductor region, wherein the second doped semiconductor region is of a second conductivity type opposite the first conductivity type.

Abstract: A temperature-regulating mattress system provides dynamic adjustment of temperature and other parameters throughout a user's sleep cycle to maximize the quality of the user's sleep, Features of the system may include: (a) heating and cooling temperature regulation (with dynamic custom profiles that control humidity and are dual-zone); (b) smart controls (with remotes and apps that learn from users to optimize settings and work with smart home products such as Alexa and interactive lighting systems); (c) comfort (with a mattress that provide the necessary support for its users); and (d) sensors used for temperature and humidity estimation algorithms, control mechanism, and additional inferences from those sensors (pose, enrichment of biometric sensing data, etc.).

Abstract: An interactive lighting system includes a group of one or more portable lamps designed to respond to user's spatial manipulation of a lamp to control the system. The lamps can be wirelessly linked to operate in unison, and each lamp could also include an ambient light sensor, which helps the system to optimize illumination characteristics and profile.

Abstract: An integrated circuit structure includes a semiconductor substrate; a diode; and a phase change element over and electrically connected to the diode. The diode includes a first doped semiconductor region of a first conductivity type, wherein the first doped semiconductor region is embedded in the semiconductor substrate; and a second doped semiconductor region over and adjoining the first doped semiconductor region, wherein the second doped semiconductor region is of a second conductivity type opposite the first conductivity type.

Abstract: An integrated circuit structure includes a semiconductor substrate; a diode; and a phase change element over and electrically connected to the diode. The diode includes a first doped semiconductor region of a first conductivity type, wherein the first doped semiconductor region is embedded in the semiconductor substrate; and a second doped semiconductor region over and adjoining the first doped semiconductor region, wherein the second doped semiconductor region is of a second conductivity type opposite the first conductivity type.

Abstract: A winder accessory comprises a gripper assembly adapted to be releasably attached to a rail. A cord winder mechanism is supported on the gripper and comprises a spooling mechanism for winding a cord. The spool mechanism rotates on a rotating joint about a first axis of rotation relative to the gripper. The spooling mechanism may comprise a wireform. A detachable pivot joint may be provided between the cord winder mechanism and the gripper assembly that defines a second axis of rotation.

Abstract: An integrated circuit structure includes a semiconductor substrate; a diode; and a phase change element over and electrically connected to the diode. The diode includes a first doped semiconductor region of a first conductivity type, wherein the first doped semiconductor region is embedded in the semiconductor substrate; and a second doped semiconductor region over and adjoining the first doped semiconductor region, wherein the second doped semiconductor region is of a second conductivity type opposite the first conductivity type.

Abstract: An analog-to-digital converter (ADC) includes a plurality of comparators connected to the ADC. The ADC further includes a plurality of switches, wherein switches connected to a corresponding comparator of the plurality of comparators are configured to alternate the corresponding comparator between normal operation and a calibration configuration. The ADC further includes at least one comparator of the plurality of comparators other than the corresponding comparator is configured for normal operation if the corresponding comparator is configured for calibration.

Abstract: An integrated circuit structure includes a semiconductor substrate; a diode; and a phase change element over and electrically connected to the diode. The diode includes a first doped semiconductor region of a first conductivity type, wherein the first doped semiconductor region is embedded in the semiconductor substrate; and a second doped semiconductor region over and adjoining the first doped semiconductor region, wherein the second doped semiconductor region is of a second conductivity type opposite the first conductivity type.

Abstract: An analog-to-digital converter (ADC) includes a plurality of comparators connected to the ADC. The ADC further includes a plurality of switches, wherein switches connected to a corresponding comparator of the plurality of comparators are configured to alternate the corresponding comparator between normal operation and a calibration configuration. The ADC further includes at least one comparator of the plurality of comparators other than the corresponding comparator is configured for normal operation if the corresponding comparator is configured for calibration.

Abstract: An analog-to-digital converter (ADC) including a plurality of comparators connected to the ADC. The ADC further includes a first pair of terminals and a second pair of terminals connected to each of the plurality of comparators. The ADC further includes a first pair of switches coupled to each of the first pair of terminals and a second pair of switches coupled to each of the second pair of terminals, where the first and second pair of switches are configured to alternate a corresponding comparator between normal operation and a calibration configuration. Comparators other than the corresponding comparator are configured for normal operation if the corresponding comparator is configured to be calibrated.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.

Abstract: The reliability of an integrated circuit is inferred from the operational characteristics of sample metal oxide semiconductor (MOS) devices switchably coupled to drain/source bias and gate input voltages that are nominal, versus voltage and current conditions that elevate stress and cause temporary or permanent degradation, e.g., hot carrier injection (HCI), bias temperature instability (BTI, NBTI, PBTI), time dependent dielectric breakdown (TDDB). The MOS devices under test (preferably both PMOS and NMOS devices tested concurrently or in turn) are configured as current sources in the supply of power to a ring oscillator having cascaded inverter stages, thereby varying the oscillator frequency as a measure of the effects of stress on the devices under test, but without elevating the stress applied to the inverter stages.

Abstract: A dulling assembly includes a corrugated bundle having a plurality of generally vertically oriented planar paperboard sheets with fluted paperboard sheets located therebetween, each fluted paperboard sheet being adhered to the two planar paperboard sheets it is located between, and a plurality of grains of sand adhered with glue to a top surface of the corrugated bundle. A method of creating a dulling assembly includes the steps of providing a corrugated bundle, applying glue to a top surface of the corrugated bundle; and applying sand to the top surface of the corrugated bundle.

Abstract: A pipelined ADC includes a first, second, and third pairs of comparators. The first pair of comparators compare an input voltage to a first positive reference voltage and to a first negative reference voltage. The second pair of comparators compare the input voltage to a second positive reference voltage and to a second negative reference voltage. Each comparator of the first and second pairs of comparators outputs a digital signal to an encoder. A third pair of comparators compares the input voltage to a third positive reference voltage and to a third negative reference voltage, and a comparator compares the input voltage to ground. The comparator and each comparator of the third pair of comparators is configured to output respective digital signals to an encoder. A multiplying digital-to-analog converter outputs a voltage based on the input voltage, an output from the encoder, and an output of the random number generator.