Abstract: The present invention is a novel method of preparing copper sheeting for exposure to UV or optical light in the process of manufacturing flexible printed circuit boards. This method seeks to remove the need for the highly complex, costly, and capital-intensive use of collimated UV lights and vacuum chambers in conventional FPCB manufacturing by preparing copper sheeting for non-vacuum non-collimated UV exposure with a relatively trivial method using clear vinyl stickers, conventional toner-adhering decorative foil, and UV reflective glue. This in turn will “democratize” the design, development, fabrication, production, and distribution of advanced electronics that depend upon the use of high-precision FPCBs.