Patents by Inventor Jordi GIMENEZ MANENT

Jordi GIMENEZ MANENT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Supplying build material
    Patent number: 11260591
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • Removable 3D build module comprising a memory
    Patent number: 11072027
    Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando Juan, Pau Martin Vidal, Esteve Comas, Jordi Gimenez Manent, Pol Morral, Pablo Dominguez Pastor
  • Recoater for 3D printers
    Patent number: 10751940
    Abstract: According to an example, a recoater for a three-dimensional (3D) printer may include a cylindrical element having a surface to spread build material particles. The build material particles may have a specified average dimension and the surface may include a plurality of depressions that have dimensions that are smaller than the specified average dimension of the build material particles.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: August 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Haseeb Yusef, William Winters, Jordi Gimenez Manent, Xavier Gasso Puchal, Eduardo Ruiz Martinez, Drew Berwager, Brent Ewald, Micah Aberth
  • SUPPLYING BUILD MATERIAL
    Publication number: 20200147885
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • Supplying build material
    Patent number: 10569467
    Abstract: A method of delivering build material from a build material store (404) to a supply module (102). The method comprises moving, using a rotatable vane (116), a portion of build material from the supply module (102) to the top of the supply module (102), and spreading the moved portion of build material across the support platform (104).
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: February 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • RECOATER FOR 3D PRINTERS
    Publication number: 20190039301
    Abstract: According to an example, a recoater for a three-dimensional (3D) printer may include a cylindrical element having a surface to spread build material particles. The build material particles may have a specified average dimension and the surface may include a plurality of depressions that have dimensions that are smaller than the specified average dimension of the build material particles.
    Type: Application
    Filed: October 27, 2016
    Publication date: February 7, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Haseeb YUSEF, William WINTERS, Jordi GIMENEZ MANENT, Xavier GASSO PUCHAL, Eduardo RUIZ MARTINEZ, Drew BERWAGER, Brent EWALD, Micah ABERTH
  • SUPPLYING BUILD MATERIAL
    Publication number: 20180071985
    Abstract: A method of delivering build material from a build material store (404) to a supply module (102). The method comprises moving, using a rotatable vane (116), a portion of build material from the supply module (102) to the top of the supply module (102), and spreading the moved portion of build material across the support platform (104).
    Type: Application
    Filed: July 7, 2015
    Publication date: March 15, 2018
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • REMOVABLE 3D BUILD MODULE COMPRISING A MEMORY
    Publication number: 20180001567
    Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
    Type: Application
    Filed: January 20, 2015
    Publication date: January 4, 2018
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando JUAN, Pau MARTIN VIDAL, Esteve COMAS, Jordi GIMENEZ MANENT, Pol MORRAL, Pablo DOMINGUEZ PASTOR