Patents by Inventor Jordi Suarez-Jimenez

Jordi Suarez-Jimenez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically-cooled power module
    Patent number: 8995134
    Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: March 31, 2015
    Assignee: Lear Corporation
    Inventors: Jose Alberto Saez-Zamora, Xavier Jorda-Sanuy, Jordi Suarez-Jimenez, Jose Gabriel Fernandez-Banares, Xavier Perpina-Giribet, Miquel Vellvehi-Hernandez, Laurent Aubouy
  • ELECTRICALLY-COOLED POWER MODULE
    Publication number: 20120299375
    Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 29, 2012
    Applicant: LEAR CORPORATION
    Inventors: Jose Alberto Saez-Zamora, Xavier Jordà-Sanuy, Jordi Suarez-Jimenez, Jose Gabriel Fernandez-Bañares, Xavier Perpiña-Giribet, Miquel Vellvehi-Hernandez, Laurent Aubouy