Abstract: A process shutter arrangement for a vacuum process system is disclosed. The arrangement includes a shutter disc having an essentially circumferential outer diameter DDo, a thickness t, a first surface, and a second surface. The disc includes at least three positioning mortises in the first surface near the outer diameter DDo. Each mortise being centered with respect to a radially axis ?1-3 in an xy-plane of the disc and having two long sides a positioned in parallel or right angled to the respective axis ?1-3. A shutter arm includes a bearing sickle with an inner periphery DSi, and at least three positioning tenons near or adjacent to the inner diameter DSi, and corresponding with positioning mortises to position the disc when set on the positioning tenons or on an optional bearing surface of the sickle.

Abstract: The present invention relates to a method for applying hexagonal boron nitride to a rough surface, wherein it is intended for the boron nitride to be provided as a temperature-resistant lubricant of the surface. According to the invention, a pin composed of hexagonal boron nitride is rubbed with pressure over the rough surface, such that abraded boron nitride adheres to the surface.

Abstract: The present invention relates to a method for applying hexagonal boron nitride to a rough surface, wherein it is intended for the boron nitride to be provided as a temperature-resistant lubricant of the surface. According to the invention, a pin composed of hexagonal boron nitride is rubbed with pressure over the rough surface, such that abraded boron nitride adheres to the surface.

Abstract: The present invention relates to a method for applying hexagonal boron nitride to a rough surface, wherein it is intended for the boron nitride to be provided as a temperature-resistant lubricant of the surface. According to the invention, a pin composed of hexagonal boron nitride is rubbed with pressure over the rough surface, such that abraded boron nitride adheres to the surface.

Abstract: An inline vacuum processing apparatus for processing of substrates in vacuum comprises at least one load-lock chamber, at least two subsequent deposition chambers to be operated with essentially the same set of coating parameters and at least one unload-lock chamber plus means for transferring, post-processing and/or handling substrates through and in the various chambers. A method for depositing a thin film on a substrate in such processing system comprises the steps of introducing a first substrate into a load-lock chamber, lowering the pressure in said chamber; transferring the substrate into a first deposition chamber; depositing a layer of a first material on said first substrate using a first set of coating parameters; transferring said first substrate into a second, subsequent deposition chamber of said inline system without breaking vacuum and depositing a further layer of said first material on said first substrate using substantially the same set of parameters.

Abstract: A holding device for a vacuum unit has a lifting table transferable between a lower end position and an upper end position for moving a support plate toward the underside of a disc-shaped workpiece. The workpiece is supported by a support ring carrying centring pins spaced to form an equilateral triangle, in the center of which the axis of the support plate is located. A clamping ring clamps the workpiece with the support ring. The centring pins engage the clamping ring to center the support ring and clamping ring relative to the support plate axis so they are not affected by thermal expansion.

Abstract: A method of mounting a vacuum process arrangement comprises providing a cooling plate having at least one channel and at least one bayonet locking means. A heat conducting membrane is then placed over each channel of the cooling plate. A target plate having at least one bayonet locking means is also provided. The locking plate is then locked to the cooling plate over the channels by engaging the bayonet locking means of the target plate with the bayonet locking means of the cooling plate by limited relative axial and rotational movement between the plates. Finally, a cooling medium is introduced in the channels of the cooling plate and pressurized.