Abstract: Probe systems and methods including active environmental control are disclosed herein. The methods include placing a substrate, which includes a device under test (DUT), on a support surface of a chuck. The support surface extends within a measurement environment that is at least partially surrounded by a measurement chamber. The methods further include determining a variable associated with a moisture content of the measurement environment and receiving a temperature associated with the measurement environment. The methods also include supplying a purge gas stream to the measurement chamber at a purge gas flow rate and selectively varying the purge gas flow rate such that a dew point temperature of the measurement environment is within a target dew point temperature range. The methods further include providing a test signal to the DUT and receiving a resultant signal from the DUT. The systems include probe systems that perform the methods.

Abstract: Systems and methods for rotational alignment of a device under test are disclosed herein. These systems include a chuck that includes a rotational positioning assembly that includes a lower section and an upper section that is configured to selectively rotate relative to the lower section about a rotational axis. The rotational positioning assembly further includes a first bearing that is configured to support a radial load between the upper section and the lower section and a second bearing that is configured to support a thrust load between the upper section and the lower section. The methods include providing a fluid stream to the second bearing to permit rotation of the upper section relative to the lower section, rotating the upper section relative to the lower section, and ceasing the providing the fluid stream to the second bearing to restrict rotation of the upper section relative to the lower section.

Abstract: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern.

Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern.

Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

Abstract: A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.

Abstract: A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.

Abstract: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

Abstract: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

Abstract: A micromanipulator for moving a probe comprises two elements which are mechanically connected to one another in such a way that one element can be moved relative to other element. The movement of the element occurs as a result of the pressure change of a fluid which acts upon an actuator which is in mechanical contact to a mobile element or to an element moving on a surface segment.

Abstract: A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.

Abstract: A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.

Abstract: A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.

Abstract: A process is provided for inspection of a variety of structures on the basis of a golden template, that was attained by recording and statistical analysis of greyscale pictures and is compared to the greyscale picture of the structure to be evaluated based on position. The underlying task is to report any such inspection process, with which a positioning of the test structure relative to the golden template and a structure detection with sub-pixel accuracy is carried out. In positioning of each further structure to be recorded, which follows a first recorded structure, the further structure is fundamentally positioned in accordance with the first positioned structure, applicable characteristic values of the greyscale picture recorded in this position are determined and hence a degree of similarity is determined.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.