Patents by Inventor Jorg Kindermann

Jorg Kindermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060162957
    Abstract: One embodiment of the present invention relates to a printed circuit board comprising one inner metal layer sandwiched between a first and a second insulating layers, wherein the inner metal layer is structured to comprise a conductive path and a bond pad, wherein the first insulating layer includes a recess for receiving an integrated device, wherein the bond pad of the inner metal layer is located in the recess.
    Type: Application
    Filed: January 24, 2005
    Publication date: July 27, 2006
    Inventors: Jorg Kindermann, Simon Albert