Abstract: In the case of a method and an apparatus for treating substrates, resist layers are removed from the substrates by spraying with process solution. The substrates are sprayed with the process solution first in a main stripping module and then in a post-stripping module and the said process solution collects in containers under the modules. At least one container is respectively provided for each module. The process solution is collected in the main stripping module in two containers and first fed directly into a second container, which is largely separated from the first container by a wall, which is liquid-permeable in a region significantly below the surface level of the process solution. Process solution is taken from the first container without froth and returned once again into the cycle of the process for wetting the substrates.

Abstract: In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit.