Patents by Inventor Jorg Moser

Jorg Moser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method For Producing A Semiconductor Wafer With Profiled Edge
    Publication number: 20070264911
    Abstract: Semiconductor wafers with profiled edges, are produced with decreased losses due to edge or other damage by separating a semiconductor wafer from a crystal; profiling the edge in a profile producing step wherein the edge is mechanically machined to a profile that is true to scale with respect to a predefined target profile; mechanically machining the wafer to reduce the a thickness of the semiconductor wafer; and machining the edge profile to acquire the target profile.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 15, 2007
    Applicant: SILTRONIC AG
    Inventors: Joachim Mattes, Anton Huber, Jorg Moser
  • Method and device for cutting a multiplicity of disks from a hard brittle workpiece
    Patent number: 6390896
    Abstract: A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: May 21, 2002
    Assignee: Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Anton Huber, Joachim Junge, Jörg Moser