Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Abstract: The invention relates to a laser chip located between a first and a second electrically and thermally conductive component, wherein: a first lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the first component; the second lateral surface of the laser chip is connected in a planar manner to a first lateral surface of the second component; the laser chip has a radiation side which is located between the components; the radiation side is arranged set back inwardly at a predefined distance from the first end faces of the components; and a radiation space, which extends from the radiation side of the laser chip to the first end faces of the components is formed between the first lateral surfaces of the two components and adjacent to the radiation side of the laser chip.

Abstract: The invention relates to a method for producing optoelectronic components. The invention comprises: provision of a metal substrate, the substrate having a front side and a rear side opposite the front side; front-side removal of substrate material such that the substrate comprises substrate sections protruding in the region of the front side and recesses arranged there between; formation of a plastic body adjacent to substrate sections; arrangement of optoelectronic semiconductor chips on substrate sections; rear-side removal of substrate material in the region of the recesses, such that the substrate is structured into separate substrate sections; and performance of a separation process. The plastic body is divided into separate substrate sections and individual optoelectronic components with at least one optoelectronic semiconductor chip are formed. The invention also relates to an optoelectronic component.

Abstract: The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.

Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.

Abstract: To secure an optical lens over an optoelectronic transmitter or receiver, it is proposed to use a UV-initiated or photoinitiated, cationically curing epoxy resin, by means of which the bonded joint can be set and thereby fixed in a few seconds. Also proposed, for use as adhesives, are resin compositions that can be applied as liquids, are optically matched, and are optimized for durable, reliable use in optoelectronic components and for the large-scale manufacture thereof.

Abstract: The invention related to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.

Abstract: Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical connections, which are electrically conductively connected to at least two electrical contacts of the semiconductor chip, and an encapsulation material.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

Abstract: A radiation-emitting component (1) comprising a radiation source, a housing body (6), a radiation exit side (16), an underside (17) which is opposite the radiation exit side (16), a side surface (18) which connects the radiation exit side (16) and the underside (17), and at least one first contact region (2a, 3a). The first contact region (2a, 3a) extends along the side surface (18) and is in the form of a partial region of a carrier (23) that runs outside the housing body (6).

Abstract: The invention describes a leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. Said leadframe-based housing comprises electrical connector strips and at least one chip mounting area, and provided according to the invention in one of the connector strips is an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.

Abstract: A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet (12, 14).

Abstract: Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 ?m. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).