Abstract: A luminophore from the class of nitridic or oxynitridic luminophores with at least one cation M and an activator D, wherein a proportion x of the cation is replaced with Cu and D is at least one element from the series Eu, Ce, Sm, Yb and Tb

Abstract: In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).

Abstract: A luminophore from the class of nitridic or oxynitridic luminophores with at least one cation M and an activator D, wherein a proportion x of the cation is replaced with Cu and D is at least one element from the series Eu, Ce, Sm, Yb and Tb

Abstract: A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.

Abstract: A luminescence conversion of LED, which uses a blue emitting chip and two illuminating substances, whereby one emits a red and the other a yellow to green. Both illuminating substances are separated upstream from the chip.

Abstract: In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).

Abstract: A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.

Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

Abstract: An optoelectronic component is described, comprising a semiconductor body that emits electromagnetic radiation of a first wavelength when the optoelectronic component is in operation, and a separate optical element disposed spacedly downstream of the semiconductor body in its radiation direction. The optical element comprises at least one first wavelength conversion material that converts radiation of the first wavelength to radiation of a second wavelength different from the first.

Abstract: LEDs having a low color temperature up to 5000 K, comprising a blue-emitting LED and, connected upstream thereof, two phosphors having a first phosphor from the class of the chliorosilicates and a second phosphor from the class of the nitridosilicates having the formula (Ca,Sr)2Si5N8:Eu.

Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

Abstract: The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).

Abstract: LED with a low color temperature up to 3500 K, comprising a blue-emitting LED with two phosphors in front of it, a first phosphor from the class of the oxynitridosilicates, having a cation M, which is doped with divalent Europium, and has the empirical formula M(1-c)Si2O2N2:Dc, with M=Sr, or M=Sr(1-x-y)BayCax with x+y<0.5 being used, the oxynitridosilicate completely or predominantly comprising the high-temperature-stable modification HT, and a second phosphor from the class of the nitridosilicates of formula (Ca,Sr)2Si5N8:Eu.

Abstract: The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).