Abstract: The present embodiments relate to a magnetic resonance local coil with a receive antenna for receiving magnetic resonance signals. The magnetic resonance local coil also includes a transmission unit for transmitting magnetic resonance signal data generated on the basis of the magnetic resonance signals via a data transmit antenna of the magnetic resonance local coil to a signal data receiving unit of a magnetic resonance tomography systems. The transmission unit is provided, at least in sections, with screening with a first metal coating and a first dielectric coating.

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: The embodiments relate to a piezoelectric component including at least one fully active piezoelectric element comprising electrode layers and piezoelectric layers arranged therebetween. The electrode layers are conveyed to a lateral edge of the piezoelectric element and contacted there. The external electrode is attached in a structured fashion for electrical contacting and/or a structured external electrode is made available: The external electrode essentially includes two components, namely the contacting field and the contacting path. In the event of several piezoelectric elements (piezoelectric actuator in multilayer structure) stacked one above the other, the contacting path functions as a collector electrode, which connects the contacting fields of the piezoelectric elements to one another. The insulation path exists for the electrical insulation of the contacting path from electrode layers which are not to be contacted.

Abstract: A three-dimensional micro-structure has a plurality of adjacent micro-columns which are arranged at a distance from each other and essentially parallel in relation to the respective longitudinal extension. The micro-columns are made of at least one micro-column material having respectively an aspect ratio in the region of 20-1000 and respectively a micro-column diameter in the region of 0.1 ?m-200 ?m. A micro-column intermediate chamber is arranged between adjacent micro-columns having a micro-column distance selected from between the adjacent micro-columns in the region of 1 ?m-100 ?m. According to a method for producing the three-dimensional micro-structures: a) a template is provided with template material, b) the micro-column material is arranged in the column-like cavities, and c) the template is at least partially removed.

Abstract: A thermo-electric energy converter converts thermal energy into electric energy and vice-versa. A three-dimensional micro-structure has micro-columns with different micro-column materials. The micro-column materials have different Seebeck-coefficients (thermopower). The diameters of said micro-columns which are arranged parallel to each other are from 0.1 ?m-200 ?m. The micro-columns have, respectively, an aspect ratio between 20-1000. Also, the micro-columns are coupled together as thermo-pairs for building a thermo-voltage. In order to produce the micro-structure, a template has a three-dimensional template structure with column-like template cavities, essentially inverse to the micro-structure micro-column material is inserted in the cavities thus producing micro-columns, and the template material is at least partially removed.

Abstract: A piezoelectric component with at least one fully active piezoelement has electrode layers and interposed piezoelectric layers guided to a lateral edge of the piezoelement and contacted there. An insulating layer applied for electric contacting has an electric through-plating. An electrically conductive gas-phase deposition layer is applied directly to the electrode layer guided up to the lateral surface of the piezoelement by way of deposition from the gas phase in order to improve electric contacting. An external electrode is applied to the gas-phase deposition layer. In the case of several superposed stacked piezoelements (piezoactuator in multi-layer design), the external electrode functions as a collector electrode which connects the electrode layers to each other. The structure enables secure contacting of the electrode layers. A fully active piezoceramic multi-layer actuator with the described contacting may be used in automobile technology for activating fuel-injection valves.

Abstract: According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks (10) are electrochemically or mechanically processed in such a way that a recess structure is obtained. The lateral surfaces (22; 24) of the electrodes (20) inside these recesses are electrically insulated using the slip casting method in order to be able to contact the remaining electrodes by imprinting an outer metallization.

Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract: In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

Abstract: In a device for the detection of thermal radiation which and a method for production of such a device, a stack is formed with at least one detector support having at least one detector element for the conversion of the thermal radiation into an electric signal, at least one circuit support with at least one read-out circuit for reading out the electrical signal and at least one cover to shield the detector element, wherein the detector support and the cover are so arranged with respect to one another that a first stack cavity bounded by the detector support and the cover is provided between the detector element of the detector support and the cover and that the circuit support and the detector support are so arranged with respect to one another that at least one second stack cavity bounded by the circuit support and the detector support is provided between detector support and the circuit support and that the first hollow stack support and/or the second stack cavity is evacuated or can be evacuated.

Abstract: In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.

Abstract: A piezoelectric component with at least one fully active piezoelement has electrode layers and interposed piezoelectric layers. guided to a lateral edge of the piezoelement and contacted there. An insulating layer applied for electric contacting has an electric through-plating. An electrically conductive gas-phase deposition layer is applied directly to the electrode layer guided up to the lateral surface of the piezoelement by way of deposition from the gas phase in order to improve electric contacting. An external electrode is applied to the gas-phase deposition layer. In the case of several superposed stacked piezoelements (piezoactuator in multi-layer design), the external electrode functions as a collector electrode which connects the electrode layers to each other. The structure enables secure contacting of the electrode layers. A fully active piezoceramic multi-layer actuator with the described contacting may be used in automobile technology for activating fuel-injection valves.

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.

Abstract: The embodiments relate to a piezoelectric component including at least one fully active piezoelectric element comprising electrode layers and piezoelectric layers arranged therebetween. The electrode layers are conveyed to a lateral edge of the piezoelectric element and contacted there. The external electrode is attached in a structured fashion for electrical contacting and/or a structured external electrode is made available: The external electrode essentially includes two components, namely the contacting field and the contacting path. In the event of several piezoelectric elements (piezoelectric actuator in multilayer structure) stacked one above the other, the contacting path functions as a collector electrode, which connects the contacting fields of the piezoelectric elements to one another. The insulation path exists for the electrical insulation of the contacting path from electrode layers which are not to be contacted.

Abstract: According to various production methods for producing a piezoceramic multilayer actuator, in the course of the production method, multilayer locks (10) are electrochemically or mechanically processed in such a way that a recess structure is obtained. The lateral surfaces (22; 24) of the electrodes (20) inside these recesses are electrically insulated using the slip casting method in order to be able to contact the remaining electrodes by imprinting an outer metallization.

Abstract: In a method for producing a multilayer encapsulation (1) of a piezo actuator (5) such that the piezo actuator (5) is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (1), an electrically insulating elastic layer (10) is first applied to the surface of the piezo actuator (5), whereupon a metallic layer is applied to the electrically insulating elastic layer (10) so as to planarly cover the same.

Abstract: A method for the production of an encapsulated and at least partly organic electronic device wherein the device comprises a combination of three groups of different electronic units or components which may be separate discrete structures arranged to be produced independently from one another electrically conductively interconnected, the groups including inorganic units, passive units and active units or active components such as antennae, diodes (rectifier diodes and/or light-emitting diodes), some of which units may be organic, e.g., organic transistors, and so on, and forming a resulting optimized circuit. The components of the three groups of units forming the resulting circuit are combined on a one piece flexible substrate film which can also serve as an encapsulation layer for the device.

Abstract: According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

Abstract: A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.