Patents by Inventor Jorge A. Alvarez Gonzalez

Jorge A. Alvarez Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10408860
    Abstract: An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 10, 2019
    Assignee: Intel Corporation
    Inventors: Jorge A. Alvarez Gonzalez, Fernando Gonzalez Lenero, Antonio Zenteno Ramirez, Fernando Mendoza Hernandez
  • Publication number: 20180284156
    Abstract: An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: Jorge A. Alvarez Gonzalez, Fernando Gonzalez Lenero, Antonio Zenteno Ramirez, Fernando Mendoza Hernandez