Abstract: A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.

Abstract: An o-ring free cooling pallet for holding a carrier is disclosed. The pallet comprises a first clamp fixed to a planar surface of the pallet for coupling with a first edge of the carrier. The pallet also comprises a second clamp removably coupled to the planar surface of the pallet for coupling with a second edge of the carrier, wherein the second clamp comprises a spring mechanism for applying a force to the second edge of the carrier that is substantially parallel to the planar surface, the force for coupling the carrier to the pallet.

Abstract: A shaper for shaping an ion beam and that can be used for both deposition and etching is described. The shaper includes a plate that is placed between an ion beam grid and an ion beam source. The plate covers holes in the grid, and is shaped and dimensioned such that the plate does not partially cover any holes in the grid that are directly adjacent to the plate. A hole is configured to mount the shaper at a center of the grid and at least one other hole is configured to secure the shaper to the grid to prevent the shaper from rotating relative to the grid. A center mount portion covers holes in the grid. The plate has two axes of reflection symmetry. The uniformity of both deposition and etching is improved.

Abstract: Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

Abstract: An o-ring free cooling pallet for holding a carrier is disclosed. The pallet comprises a first clamp fixed to a planar surface of the pallet for coupling with a first edge of the carrier. The pallet also comprises a second clamp removably coupled to the planar surface of the pallet for coupling with a second edge of the carrier, wherein the second clamp comprises a spring mechanism for applying a force to the second edge of the carrier that is substantially parallel to the planar surface, the force for coupling the carrier to the pallet.

Abstract: A method for forming a planarized surface for at least one bar of sliders for utilization in a hard disk drive is disclosed. In general, at least one bar of sliders is placed on an adhesive layer. A single thermoplastic layer is then provided above the at least one bar of sliders. The single thermoplastic layer is then heated to a softening temperature such that the single thermoplastic layer will flow between the at least one bar of sliders. The single thermoplastic layer is then cooled to form a planarized surface of both said single thermoplastic layer and said at least one bar of sliders at said adhesive layer.

Abstract: A shaper for shaping an ion beam and that can be used for both deposition and etching is described. The shaper includes a plate that is placed between an ion beam grid and an ion beam source. The plate has two axes of reflection symmetry. The uniformity of both deposition and etching is improved.

Abstract: Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.

Abstract: Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

Abstract: Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.