Patents by Inventor Jorge C. Marcet

Jorge C. Marcet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8198903
    Abstract: A chassis shielding effectiveness evaluation system includes a chassis having a chassis ground. A board is located in the chassis and includes a board ground layer. A signal generator includes at least one ground member coupled to the chassis ground and a signal member coupled to the board ground layer. The signal generator is operable to send a signal through the signal member to the board ground layer.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: June 12, 2012
    Assignee: Dell Products L.P.
    Inventors: Jeffrey C. Hailey, Jorge C. Marcet, Leroy Jones, Jr., Raymond A. McCormick, Todd W. Steigerwald, Tze-Chuen Toh
  • Patent number: 8064220
    Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: November 22, 2011
    Assignee: Dell Products L.P.
    Inventors: Chase Berry, Gary Thomason, James Utz, Steven L. Williams, Jorge C. Marcet
  • Publication number: 20110169503
    Abstract: A chassis shielding effectiveness evaluation system includes a chassis having a chassis ground. A board is located in the chassis and includes a board ground layer. A signal generator includes at least one ground member coupled to the chassis ground and a signal member coupled to the board ground layer. The signal generator is operable to send a signal through the signal member to the board ground layer.
    Type: Application
    Filed: January 14, 2010
    Publication date: July 14, 2011
    Applicant: DELL PRODUCTS L.P.
    Inventors: Jeffrey C. Hailey, Jorge C. Marcet, Leroy Jones, JR., Raymond A. McCormick, Todd W. Steigerwald, Tze-Chuen Toh
  • Publication number: 20090231788
    Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.
    Type: Application
    Filed: February 21, 2008
    Publication date: September 17, 2009
    Inventors: Chase Berry, Gary Thomason, James Utz, Steven L. Williams, Jorge C. Marcet