Patents by Inventor Jorge Contreras Perez

Jorge Contreras Perez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BACKSIDE INTEGRATED TORSION LOADING MECHANISM
    Publication number: 20230395460
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.
    Type: Application
    Filed: August 16, 2023
    Publication date: December 7, 2023
    Inventors: David Shia, Rick Canham, Eric W. Buddrius, Jeffory L. Smalley, John Beatty, Kenan Arik, Mohanraj Prabhugoud, Kirk Wheeler, Shelby Ferguson, Jorge Contreras Perez, Daniel Neumann, Ernesto Borboa Lizarraga
  • Multi-surface heat sink suitable for multi-chip packages
    Patent number: 11495518
    Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: November 8, 2022
    Assignee: Intel Corporation
    Inventors: Shrenik Kothari, Sandeep Ahuja, Susan Smith, Jeffory Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez, Je-Young Chang, Jorge Contreras Perez, Phil Geng, Andres Ramirez Macias, Gilberto Rayas Paredes
  • Method and apparatus for detaching a microprocessor from a heat sink
    Patent number: 11296009
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey
  • MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
    Publication number: 20200251403
    Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 6, 2020
    Applicant: Intel Corporation
    Inventors: Shrenik Kothari, Sandeep Ahuja, Susan Smith, Jeffory Smalley, Francisco Gabriel Lozano Sanchez, Maria de la Luz Belmont Velazquez, Je-Young Chang, Jorge Contreras Perez, Phil Geng, Andres Ramirez Macias, Gilberto Rayas Paredes
  • METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
    Publication number: 20190304871
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Applicant: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey