Patents by Inventor Jorge E. Badillo

Jorge E. Badillo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8659393
    Abstract: A system is provided that includes a Radio Frequency Identification (RFID) writer and a target tag within operational range of the RFID writer. The system also includes a processor coupled to the RFID writer and a memory coupled to the processor, wherein the memory stores instructions that, when executed, cause the processor to prepare a target tag value for the target tag. The target tag value comprises a position vector that identifies a positioning of data fields of the target tag value.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: February 25, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter A Melendez, Steven J. Simske, Jorge E. Badillo, Alipio Caban
  • Patent number: 8269629
    Abstract: Aspects of the present invention describe a method of tracking an item, comprising. The items is associated with a tag and capable of responding to a query from a tag reader and tag combination. The tag reader and tag combination capable of identifying the item associated with the tag using a tag reader. In operation, a tag reader makes a request to at least one tag reader and tag combination for the identity of an item associated with a tag. The tag reader and tag combination identifies the item associated with the tag and provides the identity of the item and tag to the tag reader.
    Type: Grant
    Filed: November 21, 2005
    Date of Patent: September 18, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Geoff Lyon, Salil Pradhan, Bill Serra, Allpio Caban, Jorge E Badillo
  • Patent number: 7372366
    Abstract: A seal for a package includes a circuit having electrical characteristics that change under mechanical deformation and an attaching material coupled to the circuit and for attaching the circuit to the package. The seal is attached to the package and processed prior to shipping to establish an untampered state for the seal. This includes identifying a circuit on the sealed package according to a seal type associated with the seal, recording one or more characteristics associated with the circuit from the seal and storing the seal type and one or more characteristics associated with the circuit from the seal for later comparison. To detect tampering to the package, the seal type and corresponding seal and circuit for the seal is identified, the characteristics associated with a circuit from the seal are determined and compared with the previous characteristics recorded when the seal was initially applied to the package.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: May 13, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Geoff Lyon, Salil Pradhan, Bill Serra, Alipio Caban, Jorge E. Badillo
  • Publication number: 20080061935
    Abstract: A system is provided that includes a Radio Frequency Identification (RFID) writer and a target tag within operational range of the RFID writer. The system also includes a processor coupled to the RFID writer and a memory coupled to the processor, wherein the memory stores instructions that, when executed, cause the processor to prepare a target tag value for the target tag. The target tag value comprises a position vector that identifies a positioning of data fields of the target tag value.
    Type: Application
    Filed: August 15, 2006
    Publication date: March 13, 2008
    Inventors: Peter A. Melendez, Steven J. Simske, Jorge E. Badillo, Alipio Caban
  • Patent number: 6851874
    Abstract: A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: February 8, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jose M. Gonzalez, Enrique C. Abreu, Angel L. Enriquez, Jorge E. Badillo
  • Publication number: 20030230209
    Abstract: A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.
    Type: Application
    Filed: June 18, 2002
    Publication date: December 18, 2003
    Inventors: Jose M. Gonzalez, Enrique C. Abreu, Angel L. Enriquez, Jorge E. Badillo