Abstract: Described is an improved LED-based flashlight with discrete mechanical, electrical or electro-mechanical actuation to adjust operation of the flashlight. The control of power to the device is accomplished by switching brightness modes electronically through use of multiple drivers and/or dynamic microcontrollers. The system may apply to current regulators as well as voltage regulators. Efficiency may be optimized to minimize power losses by operating each driver chip within fixed bands, handing off regulation to other chips that function well at different input currents or voltages.

Abstract: Described is an improved LED-based flashlight with discrete mechanical, electrical or electro-mechanical actuation to adjust operation of the flashlight. The control of power to the device is accomplished by switching brightness modes electronically through use of multiple drivers and/or dynamic microcontrollers. The system may apply to current regulators as well as current regulators. Efficiency may be optimized to minimize power losses by operating each driver chip within fixed bands, handing off regulation to other chips that function well at different input currents or voltages.

Abstract: A system for digital manufacturing is described. A content repository includes digital manufacturing source files that have model information, pricing information, and rights information. A viewport for viewing a visual rendering of the digital manufacturing source file is included along with an obfuscation engine for obfuscating the digital manufacturing source file at the content repository and de-obfuscating the digital manufacturing source file at the viewport. Also included is a selection engine for choosing the digital manufacturing source file for digital manufacturing.

Abstract: A USB-to-SDIO bridge (UTSB) to efficiently transmit SD/SDIO commands in USB packets. The UTSB may allow the majority of the device drivers for a given SD/SDIO device to remain intact, requiring changes only in the lowest hardware adaptation layer to put a USB wrapper around native SD commands. These commands may be sent over USB-to-SD card reader devices that may include various embodiments of a UTSB, where they may be unwrapped and transmitted to the SD port as if the port were native to the host controller. Additionally, the SD/SDIO commands may be packaged into groups of commands, or transactions, to optimize performance. The host driver may instruct the UTSB bridge device to repeatedly read data from the SDIO device until a communications FIFO on the device is empty (corresponding to a termination condition), and return the collected data to the host.

Abstract: A USB-to-SDIO bridge (UTSB) to efficiently transmit SD/SDIO commands in USB packets. The UTSB may allow the majority of the device drivers for a given SD/SDIO device to remain intact, requiring changes only in the lowest hardware adaptation layer to put a USB wrapper around native SD commands. These commands may be sent over USB-to-SD card reader devices that may include various embodiments of a UTSB, where they may be unwrapped and transmitted to the SD port as if the port were native to the host controller. Additionally, the SD/SDIO commands may be packaged into groups of commands, or transactions, to optimize performance. The host driver may instruct the UTSB bridge device to repeatedly read data from the SDIO device until a communications FIFO on the device is empty (corresponding to a termination condition), and return the collected data to the host.

Abstract: One aspect of the invention relates to a method for synchronizing control signals with scaled digital video data.

Abstract: One aspect of the invention relates to a method for synchronizing control signals with scaled digital video data.

Abstract: A multi-layered printed circuit board having an integrated twisted pair conductor. In a preferred embodiment, the printed circuit board comprises two segmented conductor traces on a first and a second layer of the printed circuit board crisscrossing each other and a plurality of vias. The two segmented conductor traces on the first layer are connected to the two segmented conductor traces on the second layer through the vias. The twisted pair conductor may be shielded by adding a ground trace on either side of the conductor traces and a ground plane both above and below the conductor traces. The conductor traces may also be tuned to specific electrical characteristics by properly spacing the plurality of vias such that a specific number of turns per unit length are achieved. The continuous conductor traces may be further tuned by using a specific dielectric thickness as well as by designing the conductor traces to be of a specific dimension.