Abstract: A machine for bonding a wire between pads on an integrated circuit die and a cavity-down circuit package includes a wedge for transferring heat energy to one part of the wire of sufficient magnitude to bond it to the pads, a clamp for grasping and pulling on another part of the wire to break it after the bonding operation, and a positioning mechanism for moving the wedge and clamp to selectable bonding locations over the die and package; wherein both the wedge and clamp include respective passageways through which the wire is threaded and slides; the clamp moves the portion of the wire between the passageways to a first position where it makes a large angle with the wedge, and to a second position where it makes a substantially smaller angle with the wedge; and the wedge is adapted to pass the wire without bending it at both the large and small angles.