Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: The present disclosure provides complexes comprising: i) a cationic oligosaccharide comprising one or more cationic moieties bonded to a trehalose, a sucrose, or a gluco-n-oligosaccharide moiety, where n is 2-6; ii) a surfactant; and iii) one or more additives selected from: a sterol, a helper lipid, an immunomodulator, and a targeting molecule; and uses thereof.

Abstract: The present disclosure provides complexes comprising a cationic oligosaccharide and an RNA, wherein the cationic oligosaccharide comprises a plurality of cationic moieties bonded to a trehalose, a sucrose, or a gluco-n-oligosaccharide moiety, where n is 2-6, and a ratio of N/P in the complex is less than 20:1

Abstract: The present disclosure broadly provides applications of communication at ultrasound frequencies to establish transcutaneous data communication between medical devices located on and/or within a body of a patient, including inter alia: features for adjustable implants including data communication, hermetic containment, and torque amplification features.

Abstract: Disclosed herein are distraction and compression devices configured for placement between a first section of a bone and a second section of the bone, which are scalable to small implant sizes. In various embodiments, the devices include a distraction shaft having an internal cavity disposed therein, the distraction shaft being configured for fixation to the first section of bone; and a housing configured for fixation to the second bone section, wherein the distraction shaft is configured to be axially movable relative to, and disposed partially within the housing. A driving element is disposed within the housing, which is configured to rotatably drive a gear assembly, and a lead screw assembly is disposed at least partly within the internal cavity of the distraction shaft, the lead screw assembly being configured to rotatably advance and/or retract a lead screw within the internal cavity, and to be rotatably driven by the cycloid gear assembly.

Abstract: An electroencephalogram measurement device (1), comprising a support (10) on which the following components are attached and/or integrated: at least one electrode (2) for measuring EEG signals from a user (U); and at least one shielded cable (3), electrically connected to the at least one electrode (2), for transporting the EEG signals to an electrical signal amplifier (A); wherein the at least one electrode (2) and the at least one shielded cable (3) are made of threads and/or textiles. Process for manufacturing an electroencephalogram measurement device (1) whose sensor layer is partially or integrally made with threads and/or textiles.

Abstract: The present invention relates to a method for improving stability of a hydrogen gaseous dispensing system. An example of such system is hydrogen powered vehicle fuel filling station. Vehicle is filled by multiple high pressure gaseous hydrogen tubes, usually one tube at a time. For safety and reliability reasons a control requirement for such system is to be able to deliver the hydrogen at constant rate to the fuel tank so that its rate of pressure increase stays constant during entire filling process. A dual pressure regulator arrangement is proposed to better maintain flow continuity and/or pressure during tube switching.

Abstract: A semiconductor package comprises a first die thermally coupled to a first thermally conductive device. The first thermally conductive device has a first surface exposed to an exterior of the semiconductor package. The package comprises a second die thermally coupled to a second thermally conductive device, the second thermally conductive device having a second surface exposed to an exterior of the semiconductor package. The first and second dies are positioned in different horizontal planes.

Abstract: One aspect of the disclosure relates to an aspect of the disclosure relates to an adjustable implant including: a housing; a first adjustable member at least partially positioned within the housing and moveable relative to the housing; and a first actuation assembly positioned within the first adjustable member and configured to move the first adjustable member relative to the housing.

Abstract: One aspect of the disclosure relates to an adjustable implant. The adjustable implant may include a housing configured to be coupled to a first bone portion; an adjustable portion configured to be coupled to a second bone portion, the adjustable portion having a first bar; an actuator rotationally mounted within the housing, the actuator including a protrusion extending therefrom; and at least one gear having an anvil coupled thereto, wherein the protrusion of the actuator is configured to engage the anvil during rotation of the actuator to cause the adjustable portion to move relative to the housing. The protrusion may include an impact hammer surface. Also provided herein are distraction and compression systems including adjustable implants and adjustment devices therefor, and methods for adjusting such adjustable implants.

Abstract: One aspect of the disclosure relates to an aspect of the disclosure relates to an adjustable implant including: a housing; a first adjustable member at least partially positioned within the housing and moveable relative to the housing; and a first actuation assembly positioned within the first adjustable member and configured to move the first adjustable member relative to the housing.

Abstract: Various implementations include an adjustable implant such as a distraction/compression device. In certain cases, the adjustable implant can include a housing; an adjustable member at least partially positioned within the housing and configured to translate relative to the housing; and an intermediary member positioned between the housing and the adjustable member.

Abstract: According to various embodiments of the present invention, an optical capture system is provided. In one embodiment, a micro-scale optical capturing system is provided with low divergence (approximately 1°) of the incident light and low acceptance angle (<8°) of the captured light. According to embodiments, a micro-scale optical capturing system is provided with a large number of collimated high-power white LEDs as light sources, between 60 and 100 units, for example, and may be positioned at distances of about 650 mm from the sample. In one embodiment, a digital camera using 50 mm focal objective with a 25 mm length extension tube captures images of the sample. This provides a working distance of approximately 100 mm and at the same time maintains ×0.5 magnification for microscale captures, with an image size of 4×4 microns per pixel.

Abstract: The present disclosure provides implants, sensor modules, networks, and methods configured to establish transcutaneous power and transcutaneous bidirectional data communication using ultrasound signals between two or more medical devices located on and within a body of a patient.

Abstract: One aspect of the disclosure relates to an extramedullary biocompatible implant for moving bone in a patient's body. In some cases, the implant includes: a first plate configured to be attached to bone at a first location; a second plate configured to be attached to bone at a second location; and a distractor extending from the first plate and being at least partially contained within the second plate, where the distractor houses a drive system including a driver and a gear system coupled with the driver, and where the drive system is configured to cause translation of the second plate relative to the first plate.

Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.

Abstract: One aspect of the disclosure relates to an aspect of the disclosure relates to an adjustable implant including: a housing; a first adjustable member at least partially positioned within the housing and moveable relative to the housing; and a first actuation assembly positioned within the first adjustable member and configured to move the first adjustable member relative to the housing.

Abstract: A method for transmitting content (A) in a communication network (N) comprising a quantum key distribution network (QKDN) for keys, called quantum keys (Knj), the communication network comprising a key management device (KM) connected to transmission nodes (N1, N2, N3, N4, N5) and connected to said quantum key distribution network (QKDN), said transmission nodes (N1, N2, N3, N4, N5) being able to communicate in the communication network and transmit and receive quantum keys (Knj) in said quantum key distribution network, said method comprising sending and receiving control messages from and to said control plan manager (CP) in order to organise the transfer of said content (A) in said communication network (N). Also a control plan management device (CP) configured to execute such a method.

Abstract: Various implementations include an adjustable implant such as a distraction/compression device. In certain cases, the adjustable implant can include a housing; an adjustable member at least partially positioned within the housing and configured to translate relative to the housing; and an intermediary member positioned between the housing and the adjustable member.

Abstract: One aspect of the disclosure relates to an extramedullary biocompatible implant for moving bone in a patient's body. In some cases, the implant includes: a first plate configured to be attached to bone at a first location; a second plate configured to be attached to bone at a second location; and a distractor extending from the first plate and being at least partially contained within the second plate, where the distractor houses a drive system including a driver and a gear system coupled with the driver, and where the drive system is configured to cause translation of the second plate relative to the first plate.