Abstract: Methods of forming memory devices are described. Some embodiments of the disclosure utilize a low temperature anneal process to reduce bottom voids and seams in low melting point, low resistance metal buried word lines. Some embodiments of the disclosure utilize a high density dielectric cap during a high temperature anneal process to reduce bottom voids in buried word lines.

Abstract: Disclosed herein are methods and systems for analyzing a cross-sectional feature of a structural element on a semiconductor wafer to determine whether an isolated or a systemic failure to reach preselected parameters occurred.

Abstract: Methods of forming memory devices are described. Some embodiments of the disclosure utilize a low temperature anneal process to reduce bottom voids and seams in low melting point, low resistance metal buried word lines. Some embodiments of the disclosure utilize a high density dielectric cap during a high temperature anneal process to reduce bottom voids in buried word lines.

Abstract: Methods of forming memory devices are described. Some embodiments of the disclosure utilize a low temperature anneal process to reduce bottom voids and seams in low melting point, low resistance metal buried word lines. Some embodiments of the disclosure utilize a high density dielectric cap during a high temperature anneal process to reduce bottom voids in buried word lines.

Abstract: Methods of forming memory devices are described. Some embodiments of the disclosure utilize a low temperature anneal process to reduce bottom voids and seams in low melting point, low resistance metal buried word lines. Some embodiments of the disclosure utilize a high density dielectric cap during a high temperature anneal process to reduce bottom voids in buried word lines.

Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: directing a stream of material from a PVD source toward a surface of a substrate at a non-perpendicular angle to the plane of the surface to selectively deposit the material on a top portion of one or more features on the substrate and form an overhang extending beyond a first sidewall of the one or more features; and etching a first layer of the substrate beneath the one or more features selective to the deposited material.

Abstract: A system that converts acceleration to rotational energy by using gravity to lower a ballast member and buoyancy to raise it when the ballast member is filled with compressed air. The ballast's initial ascent is controlled by a brake member. This ascent causes a rack assembly to rise that actuates a compressor to refill the intermediary tank with compressed air so the cycle can repeat itself. The initial phase begins with the ballast member containing compressed air so it can ascend up a liquid-filled silo, generating rotational energy along the way using a mounted cable that travels around a wire drum. Upon reaching the top of the silo, valves will open allowing water to enter the ballast thereby sinking it to the bottom, creating additional rotational energy.

Abstract: A system that converts acceleration to rotational energy by using gravity to lower a ballast member and buoyancy to raise it when the ballast member is filled with compressed air. The ballast's initial ascent is controlled by a brake member. This ascent causes a rack assembly to rise that actuates a compressor to refill the intermediary tank with compressed air so the cycle can repeat itself. The initial phase begins with the ballast member containing compressed air so it can ascend up a liquid-filled silo, generating rotational energy along the way using a mounted cable that travels around a wire drum. Upon reaching the top of the silo, valves will open allowing water to enter the ballast thereby sinking it to the bottom, creating additional rotational energy.

Abstract: The present disclosure discloses an interlocking roof tile comprising two groove extending over length of the interlocking roof tile at both lateral ends that create side walls at the distalmost ends of the interlocking roof tile. The grooves are created on top surface of the interlocking roof tile using a press machine that uses pressure to mold the cement into the interlocking roof tiles. The interlocking roof tile's at bottom surface is flat. The interlocking roof tile further comprises at least one nail opening, provided spatially from each other to mount and secure the interlocking roof tile to the roof. In order to couple a plurality of interlocking roof tiles in series, a first interlocking roof tile is placed coupled to the second roof tile such that side wall of the first interlocking roof tile is engaged with the groove of the second interlocking roof tile.