Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

Abstract: A device that includes an integrated device and a heat dissipating device coupled to the integrated device. The heat dissipating device includes an electro-osmotic (EO) pump. The electro-osmotic (EO) pump includes a casing comprising a first opening and a second opening; a membrane located in the casing; an anode electrode; a cathode electrode; and a catalyst layer formed on a surface of the membrane. The membrane includes a plurality of channels. The electro-osmotic (EO) pump is configured to provide a fluid to flow from the first opening of the casing, through the plurality of channels of the membrane and out of the second opening of the casing. The catalyst layer is configured to recombine gas ions that are produced by the electro-osmotic (EO) pump.

Abstract: A quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. The planar vapor chamber cools the enclosed processor using both phase-change cooling/heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away).

Abstract: Some novel features pertain to a quad-rotor or other unmanned aerial drone having a planar vapor chamber mounted to a processor of the drone to cool the processor. The processor may be enclosed in a protective central housing. The vapor chamber is mounted, in some examples, with a perimeter of the vapor chamber extending from the processor through the housing into an airflow region near the rotors of the drone so that airflow, which may include propeller wash, serves to cool the perimeter of the vapor chamber. With this design, the planar vapor chamber cools the enclosed processor using both phase-change cooling/heat spreading (i.e. heat is dissipated from the processor via evaporation and subsequent condensation) and convection (i.e. airflow passing over the perimeter of the vapor chamber carries heat away). In some examples, the planar vapor chamber is turtle-shaped with legs aligned with the struts of the drone.

Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.

Abstract: A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.