Abstract: The invention regards an audio processing device with at least one encapsulated electronic component mounted and electrically connected to electric leads in a mounting substrate. Further electric components are mounted for connection with the encapsulated electronic component through the substrate and the encapsulation material is moulded onto the substrate. According to the invention at least one metal layer is deposited on a surface part of the encapsulation material. The invention further regards a method for producing an amplifier for an audio device whereby at least one encapsulated electronic component is mounted on, and electrically connected to a PCB and where the encapsulation material is provided to protect the electronic component wherein further a metal layer is generated at least on a surface area of the encapsulation material.

Abstract: A hearing aid which has a casing accommodating one or more second to electric signal converting transducers (11,12) and a signal path from the transducer (11,12) to a receiver which provides a sound signal at the ear of the user. The signal processing is provided in the signal path to ensure a signal amplification/attenuation according to the needs of the user. A battery (6) is accommodated in the casing and a battery lid is arranged with a first side (1) facing the surrounding and a second side (2) facing the interior of the casing whereby the battery lid is operable for replacement of the battery. The battery lid has a recess (3) for receiving at least one sound to electric signal converting transducer (11,12) and a sound transmission path is provided between the first side (1) of the battery lid and the at least one transducer (11, 12).

Abstract: A method for producing miniature amplifier and signal processing unit includes the steps of: producing arrays of individual integrated circuits on a side of a wafer, where each circuit has a number of I/O connection points; providing a number of solder connection pads at each integrated circuit for redistribution of the I/O connection points of the integrated circuit; coating the side of the wafer having the solder connection pads with a protection coating and ensuing through going apertures in the coating to provide electrical contact with the solder connection pads; applying electrical components onto the coating and gaining electrical contact with the solder connection pads through the apertures of the coating material; and singulating the individual amplifiers from the wafer and ensuring light protection of the edges and possible unprotected side of the amplifiers.

Abstract: The invention concerns a process for generating a feed-through in a semiconductor wafer, which has electric circuitry embedded in a front surface whereby the hole for the feed-through is generated by the combined use of a front side protection layer and a wet KOH etch process etching the hole from the back side of the wafer, where a photomasking process is subsequently used do define the via followed by deposition of the via material.

Abstract: The invention concerns a hearing aid, which has a casing accommodating one or more sound to electric signal converting transducers (11,12) and a signal path from the transducer (11,12) to a receiver which provides a sound signal at the ear of the user. The signal processing is provided in the signal path to ensure a signal amplification/attenuation according to the needs of the user. A battery (6) is accommodated in the casing and a battery lid is arranged with a first side (1) facing the surrounding and a second side (2) facing the interior of the casing whereby the battery lid is operable for replacement of the battery. According to the invention the battery lid has means (3) for receiving at least one sound to electric signal converting transducer (11,12) and a sound transmission path is provided between the first side (1) of the battery lid and the at least one transducer (11,12).

Abstract: A method for producing miniature amplifier and signal processing unit includes the steps of:

Abstract: The invention relates to a hearing aid comprising a housing; a microphone; an integrated circuit; a receiver for outputting a signal; where the integrated circuit comprises at least one semiconductor layer including the electric circuit; the at least one layer having an outer circumference; at least one through electrical connection extending from one side of the at least one layer to an opposed other side of the at least one layer; the through electrical connection being established in distance from the outer circumference of the at least one layer. The invention further relates to an integrated circuit for use in a hearing aid as described above.

Abstract: A protective element for protecting in particular an electric motor against overload currents includes in a polymer matrix, preferably ETFE, for example 40% (by volume) of a first powdered filler of a conductive material, preferably TiB2, so that, as in the case of a PTC element, the resistance increases abruptly at a switching temperature corresponding to the melting temperature of the polymer. Also added are 20% (by volume) of a second powdered filler, a phase transition material which, at a critical temperature below the switching temperature, undergoes a phase transition in which it absorbs heat of transformation. As a result, the response time (T) of the protective element is notably extended in a range of the overload current factor (F) corresponding to higher permissible motor starting currents.

Abstract: A description is given of a PTC polymer element (1) as part of an electrical component with a novel structure in which aperture angles (&agr;) on both sides of constrictions (2) in the PTC polymer material are at least 100°. As a result, an improved response behavior can be achieved, and, in connection with further features, the construction of PTC polymer elements which are more rapid, capable of carrying greater currents and have higher dielectric strengths is possible.

Abstract: The resistor body of a nonlinear resistor element having PTC characteristics includes a pulverulent first filler, whose material, e.g. TiB.sub.2, TiC, VC, WC, ZrBr.sub.2, MoSi.sub.2, has a specific conductivity of at most 10.sup.-3 .OMEGA.cm and in which the particle sizes are between 10 and 40.mu., and also, in order to improve the voltage sustaining capability by extending the switching zone and to achieve uniform energy absorption, includes a likewise pulverulent second filler having varistor characteristics and particle sizes between 50 and 200.mu., whose specific resistance at field strengths .gtoreq.2000 V/cm such as occur in the switching region of the resistor element and above, is at most 50 .OMEGA.cm, preferably at most 15 .OMEGA.cm, the fillers being embedded in a matrix made of a thermoplastic, in particular HD polyethylene or a thermoset. The average particle size of the second filler should exceed that of the first filler by a factor of from 2 to 5.

Abstract: Extending between a fixed tulip contact (1) and a slide tulip (4) is an arcing chamber (5) which is occupied in the closed position by a movable contact pin (3) which fills up both an exhaust (9) surrounded by the slide tulip (4) and a blowout opening (7) which is surrounded by the tulip contact (1) and connects the arcing chamber (5) to a pressure chamber (6). The arcing chamber (5) is surrounded by an annular heating volume (13) open toward the same. Arranged in the pressure chamber (6) is a charge (10) of explosive which is for the most part converted within approximately 10-30 ms after ignition to extinguishing gas, preferably predominantly nitrogen, the gas pressure moving the contact pin (3) toward the open position. After clearance of the blowout opening (7) and the exhaust (9), the arc drawn between the contact pin (3) and tulip contact (1) is blown out, something which is supported by the pressure buildup, to which the arc contributes, in the heating volume (13).

Abstract: The current-limiting resistor has two connection electrodes (1, 2) which are arranged parallel to one another as well as a resistance body (3) which has PTC behavior and with which large-area contact is made by the connection electrodes (1, 2). A varistor (40) is in electrically conductive contact with the resistance body (3). The resistance body (3) contains two contact areas (50, 51) as well as a response point (60) which is connected in parallel with the varistor (40) via the two contact areas (50, 51) and implements a PTC transition above a threshold value of a current flowing through the resistor.Since the resistance body effects the electrical contact with the varistor (40) in the case of this resistor, no metal connection electrodes are required for the varistor. At the same time, due to the outward displacement of the response point (60) away from the varistor (40), the operational reliability of the resistor is considerably improved.