Patents by Inventor Joribeth E. Joseff

Joribeth E. Joseff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two component, curable, hot melt adhesive
    Patent number: 6861464
    Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: March 1, 2005
    Assignee: Diversified Chemical Technologies, Inc.
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn
  • Two component, curable, hot melt adhesive
    Publication number: 20040014866
    Abstract: A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
    Type: Application
    Filed: July 19, 2002
    Publication date: January 22, 2004
    Inventors: Rajan Eadara, Mooil Chung, David Wen-Lung Chang, Sunny K. George, Patrick A. Ohaka, Joribeth E. Joseff, Yushin Ahn