Patents by Inventor Jos de Klerk

Jos de Klerk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System to increase throughput in a dual substrate stage double exposure lithography system
    Patent number: 7053990
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: May 30, 2006
    Assignee: ASML Holding N.V.
    Inventors: Daniel N. Galburt, Jos de Klerk
  • Method to increase throughput in a dual substrate stage double exposure lithography system
    Patent number: 7050156
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: May 23, 2006
    Assignee: ASML Holding N.V.
    Inventors: Daniel N. Galburt, Jos de Klerk
  • System to increase throughput in a dual substrate stage double exposure lithography system
    Patent number: 6965427
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: November 15, 2005
    Assignee: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk
  • System to increase throughput in a dual substrate stage double exposure lithography system
    Publication number: 20050248747
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
    Type: Application
    Filed: July 13, 2005
    Publication date: November 10, 2005
    Applicant: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk
  • System to increase throughput in a dual substrate stage double exposure lithography system
    Publication number: 20050162636
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.
    Type: Application
    Filed: March 18, 2005
    Publication date: July 28, 2005
    Applicant: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk
  • Method to increase throughput in a dual substrate stage double exposure lithography system
    Patent number: 6876439
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: April 5, 2005
    Assignee: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk
  • System to increase throughput in a dual substrate stage double exposure lithography system
    Publication number: 20040257551
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
    Type: Application
    Filed: July 22, 2004
    Publication date: December 23, 2004
    Inventors: Daniel N. Galburt, Jos de Klerk
  • System and method to increase throughput in a dual substrate stage double exposure lithography system
    Publication number: 20040239902
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.
    Type: Application
    Filed: August 4, 2003
    Publication date: December 2, 2004
    Applicant: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk
  • System and method to increase throughput in a dual substrate stage double exposure lithography system
    Patent number: 6781674
    Abstract: A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 24, 2004
    Assignee: ASML Holding N.V.
    Inventors: Daniel Galburt, Jos de Klerk