Patents by Inventor Jose A. Marques
Jose A. Marques has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12237443Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.Type: GrantFiled: February 15, 2022Date of Patent: February 25, 2025Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
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Publication number: 20250042717Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.Type: ApplicationFiled: April 25, 2024Publication date: February 6, 2025Inventors: António José Marques Trindade, Pierluigi Rubino
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Patent number: 12162747Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: September 21, 2020Date of Patent: December 10, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Publication number: 20240349431Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: ApplicationFiled: February 22, 2024Publication date: October 17, 2024Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Publication number: 20240347367Abstract: A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.Type: ApplicationFiled: August 9, 2021Publication date: October 17, 2024Inventors: Ronald S. Cok, António José Marques Trindade, MIchael Scharfenberg, Christian Schulz, Gabriele Roithmeier
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Patent number: 12043541Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.Type: GrantFiled: January 31, 2022Date of Patent: July 23, 2024Assignee: X-Celeprint LimitedInventors: Raja Fazan Gul, Ronald S. Cok, Steven Kelleher, António José Marques Trindade, Alin Mihai Fecioru, David Gomez, Christopher Andrew Bower, Salvatore Bonafede, Matthew Alexander Meitl
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Patent number: 12006205Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.Type: GrantFiled: September 14, 2021Date of Patent: June 11, 2024Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Pierluigi Rubino
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Patent number: 11981559Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: November 13, 2020Date of Patent: May 14, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Publication number: 20240153933Abstract: A hybrid document includes a flexible document and a component having a component substrate disposed in or on the flexible document. One or more inorganic light-emitting diodes, a controller electrically connected to the one or more inorganic light-emitting diodes for controlling the one or more inorganic light-emitting diodes, and a piezoelectric power source are disposed on the component substrate. The power source can include a plurality of electrically connected individual piezoelectric power-source elements electrically connected to the controller, the inorganic light-emitting diodes, or both. Each of the one or more inorganic light-emitting diodes, the controller, the component substrate, or each of the individual piezoelectric power-source elements can comprise a broken or separated tether. The component substrate can be a flexible substrate that is more flexible than any one of the inorganic light-emitting diodes, the controller, and the individual piezoelectric power-source elements.Type: ApplicationFiled: January 6, 2023Publication date: May 9, 2024Inventors: Ronald S. Cok, António José Marques Trindade, Pierluigi Rubino
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Patent number: 11950375Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: GrantFiled: April 30, 2021Date of Patent: April 2, 2024Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
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Patent number: 11897760Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: April 30, 2021Date of Patent: February 13, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Patent number: 11884537Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: March 15, 2021Date of Patent: January 30, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Patent number: 11863154Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.Type: GrantFiled: November 1, 2022Date of Patent: January 2, 2024Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Lei Liu, Ronald S. Cok
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Patent number: 11834330Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: October 8, 2020Date of Patent: December 5, 2023Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
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Publication number: 20230363092Abstract: A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.Type: ApplicationFiled: May 5, 2023Publication date: November 9, 2023Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok
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Publication number: 20230336150Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Inventors: António José Marques Trindade, Ronald S. Cok, Raja Fazan Gul
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Publication number: 20230327640Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: ApplicationFiled: March 9, 2023Publication date: October 12, 2023Inventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
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Publication number: 20230290663Abstract: According to embodiments of the present disclosure a micro-device comprises a frame and a component separated from the frame by a gap except where the component is connected to the frame with cantilever supports extending from the component to the frame. The internal frame contour of the frame can be non-rectangular. The external contour of the frame can be rectangular. The frame can follow the external contour of the component and cantilever supports except where the cantilever supports are connected to the frame. The internal or external contour of the frame can comprise slits extending into the frame. The gap separating the frame from the component can have a uniform width except where the cantilever supports are connected to the frame. In some embodiments, a micro-device is disposed on a target substrate comprising a cavity and the component is suspended over the cavity.Type: ApplicationFiled: March 11, 2022Publication date: September 14, 2023Inventors: António José Marques Trindade, Ronald S. Cok
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Publication number: 20230261149Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
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Patent number: 11670603Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.Type: GrantFiled: July 2, 2021Date of Patent: June 6, 2023Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Ronald S. Cok