Patents by Inventor Jose A. Marques

Jose A. Marques has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237443
    Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: February 25, 2025
    Assignee: X-Celeprint Limited
    Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
  • Publication number: 20250042717
    Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.
    Type: Application
    Filed: April 25, 2024
    Publication date: February 6, 2025
    Inventors: António José Marques Trindade, Pierluigi Rubino
  • Patent number: 12162747
    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: December 10, 2024
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
  • Publication number: 20240349431
    Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
    Type: Application
    Filed: February 22, 2024
    Publication date: October 17, 2024
    Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
  • Publication number: 20240347367
    Abstract: A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.
    Type: Application
    Filed: August 9, 2021
    Publication date: October 17, 2024
    Inventors: Ronald S. Cok, António José Marques Trindade, MIchael Scharfenberg, Christian Schulz, Gabriele Roithmeier
  • Patent number: 12043541
    Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: July 23, 2024
    Assignee: X-Celeprint Limited
    Inventors: Raja Fazan Gul, Ronald S. Cok, Steven Kelleher, António José Marques Trindade, Alin Mihai Fecioru, David Gomez, Christopher Andrew Bower, Salvatore Bonafede, Matthew Alexander Meitl
  • Patent number: 12006205
    Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: June 11, 2024
    Assignee: X-Celeprint Limited
    Inventors: António José Marques Trindade, Pierluigi Rubino
  • Patent number: 11981559
    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 14, 2024
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
  • Publication number: 20240153933
    Abstract: A hybrid document includes a flexible document and a component having a component substrate disposed in or on the flexible document. One or more inorganic light-emitting diodes, a controller electrically connected to the one or more inorganic light-emitting diodes for controlling the one or more inorganic light-emitting diodes, and a piezoelectric power source are disposed on the component substrate. The power source can include a plurality of electrically connected individual piezoelectric power-source elements electrically connected to the controller, the inorganic light-emitting diodes, or both. Each of the one or more inorganic light-emitting diodes, the controller, the component substrate, or each of the individual piezoelectric power-source elements can comprise a broken or separated tether. The component substrate can be a flexible substrate that is more flexible than any one of the inorganic light-emitting diodes, the controller, and the individual piezoelectric power-source elements.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 9, 2024
    Inventors: Ronald S. Cok, António José Marques Trindade, Pierluigi Rubino
  • Patent number: 11950375
    Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: April 2, 2024
    Assignee: X Display Company Technology Limited
    Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
  • Patent number: 11897760
    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: February 13, 2024
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
  • Patent number: 11884537
    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: January 30, 2024
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
  • Patent number: 11863154
    Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: January 2, 2024
    Assignee: X-Celeprint Limited
    Inventors: António José Marques Trindade, Lei Liu, Ronald S. Cok
  • Patent number: 11834330
    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: December 5, 2023
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
  • Publication number: 20230363092
    Abstract: A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 9, 2023
    Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok
  • Publication number: 20230336150
    Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.
    Type: Application
    Filed: April 15, 2022
    Publication date: October 19, 2023
    Inventors: António José Marques Trindade, Ronald S. Cok, Raja Fazan Gul
  • Publication number: 20230327640
    Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.
    Type: Application
    Filed: March 9, 2023
    Publication date: October 12, 2023
    Inventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
  • Publication number: 20230290663
    Abstract: According to embodiments of the present disclosure a micro-device comprises a frame and a component separated from the frame by a gap except where the component is connected to the frame with cantilever supports extending from the component to the frame. The internal frame contour of the frame can be non-rectangular. The external contour of the frame can be rectangular. The frame can follow the external contour of the component and cantilever supports except where the cantilever supports are connected to the frame. The internal or external contour of the frame can comprise slits extending into the frame. The gap separating the frame from the component can have a uniform width except where the cantilever supports are connected to the frame. In some embodiments, a micro-device is disposed on a target substrate comprising a cavity and the component is suspended over the cavity.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: António José Marques Trindade, Ronald S. Cok
  • Publication number: 20230261149
    Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 17, 2023
    Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
  • Patent number: 11670603
    Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: June 6, 2023
    Assignee: X-Celeprint Limited
    Inventors: António José Marques Trindade, Ronald S. Cok