Abstract: An optical waveguide (11) is composed substantially entirely of triazine.

Abstract: An optical waveguide (11) is composed substantially entirely of triazine. Various methods for making desired triazine waveguide patterns are described.

Abstract: The specification describes a process for making a plating mask (17), for use in printed wiring board fabrication, with greater precision and definition than has previously been possible. An insulative substrate (11) includes on one surface a thin metal film (13). The film is covered with a relatively thick first mask layer (16) which is selectively removed to expose portions of the metal film, which are in turn removed to expose portions of the insulative substrate (11). The exposed portions of the insulative substrate are covered with a relatively thick plating mask layer (17) which abuts against the first mask layer (16). The first mask layer is then removed, leaving the remaining plating mask layer as a patterned plating mask which is then used as a mask for deposited metal (19) which defines a printed circuit.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: A non-destructive method for determining the degree of cure of a polymer, e.g., a polymer film, is based upon measuring the degree of free space rotation of a fluorophore added to the polymer system through fluorescent measurements of the fluorophore. The results can be used to control, on-line, the polymerization of the polymer.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.